Inventor · disambiguated record
Minoru Yoshikawa
Also filed as: YOSHIKAWA MINORU
48 granted patents·60 pending applications·667 citations·filing 1991–2023
98Inventor score
Top patents by PatentIndex Score
108 records- 0198US6222729B1Electronic device cooling system having guides for guiding a flow of the air evenlyNEC CORP·Filed 1999·Granted Apr 24, 2001·206 cites·22 claims
- 0290US8934245B2Heat conveying structure for electronic deviceYOSHIKAWA MINORU·Filed 2010·Granted Jan 13, 2015·11 cites·7 claims
- 0386US9693485B2Cooling system for electronic device storing apparatus and cooling system for electronic device storing buildingNEC CORP·Filed 2013·Granted Jun 27, 2017·5 cites·6 claims
- 0486US5491363ALow boiling point liquid coolant cooling structure for electronic circuit packageNEC CORP·Filed 1995·Granted Feb 13, 1996·92 cites·20 claims
- 0586US5084961AMethod of mounting circuit on substrate and circuit substrate for use in the methodMICRO GIJUTSU KENKYUJYO CO LTD·Filed 1991·Granted Feb 4, 1992·103 cites·10 claims
- 0685US8398873B2Thin-sheet glass substrate laminate and method of manufacturing the sameYOSHIKAWA MINORU·Filed 2011·Granted Mar 19, 2013·11 cites·7 claims
- 0784US8593810B2Cooling deviceYOSHIKAWA MINORU·Filed 2010·Granted Nov 26, 2013·8 cites·10 claims
- 0882US11683912B2Cooling device, cooling system, and cooling methodNEC CORP·Filed 2021·Granted Jun 20, 2023·1 cites·11 claims
- 0982US6046498ADevice having a heat sink for cooling an integrated circuitNEC CORP·Filed 1998·Granted Apr 4, 2000·57 cites·14 claims
- 1081US8845134B2Cooling system for light emitting device and light emitting device using the sameCHIBA MASAKI·Filed 2011·Granted Sep 30, 2014·7 cites·20 claims
- 1179US9696068B2Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the sameNEC CORP·Filed 2013·Granted Jul 4, 2017·5 cites·8 claims
- 1279US8432695B2Cooling deviceYOSHIKAWA MINORU·Filed 2007·Granted Apr 30, 2013·9 cites·14 claims
- 1378US5465192ACooling apparatus for integrated circuit chips for preventing forcible contact between a cooling member and the chipsNEC CORP·Filed 1994·Granted Nov 7, 1995·56 cites·9 claims
- 1478US2023221084A1Heat exchangerNEC CORP·Filed 2023·Application pending·0 cites
- 1577US6157897AApparatus for monitoring ventilation of integrated circuits in electronic apparatusNEC CORP·Filed 1998·Granted Dec 5, 2000·40 cites·16 claims
- 1676US9297589B2Boiling heat transfer deviceSAKAMOTO HITOSHI·Filed 2009·Granted Mar 29, 2016·4 cites·14 claims
- 1775US9968003B2Cooling device and electronic deviceNEC CORP·Filed 2015·Granted May 8, 2018·3 cites·8 claims
- 1873US11428442B2Cooling device, control method, and storage medium related to a plurality of evaporators and a plurality of evaporator condensersNEC CORP·Filed 2019·Granted Aug 30, 2022·2 cites·14 claims
- 1973US9605907B2Phase change cooler and electronic equipment provided with sameSAKAMOTO HITOSHI·Filed 2011·Granted Mar 28, 2017·4 cites·15 claims
- 2072US9820407B2Electronic device and cooling systemNEC CORP·Filed 2014·Granted Nov 14, 2017·3 cites·10 claims
- 2171US9557117B2Cooling structure, electronic device using same, and cooling methodYOSHIKAWA MINORU·Filed 2009·Granted Jan 31, 2017·5 cites·13 claims
- 2269US10182517B2Electronic apparatus enclosure device and electronic apparatus cooling systemNEC CORP·Filed 2014·Granted Jan 15, 2019·2 cites·7 claims
- 2369US9288931B2Cooling system and device housing apparatus using the sameINABA KENICHI·Filed 2012·Granted Mar 15, 2016·3 cites·13 claims
- 2467US11614288B2Heat exchangerNEC CORP·Filed 2020·Granted Mar 28, 2023·0 cites·7 claims
- 2567US8547705B2Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each otherINABA KENICHI·Filed 2010·Granted Oct 1, 2013·3 cites·7 claims
- 2666US11821667B2Cooling apparatus and cooling methodNEC CORP·Filed 2021·Granted Nov 21, 2023·0 cites·9 claims
- 2766US9363886B2Electronic substrate and an electronic apparatusSAKAMOTO HITOSHI·Filed 2012·Granted Jun 7, 2016·2 cites·11 claims
- 2866US6251709B1Method of manufacturing a cooling structure of a multichip moduleNEC CORP·Filed 2000·Granted Jun 26, 2001·12 cites·3 claims
- 2965US11774115B2Air conditioner and method of manufacturing pipingNEC CORP·Filed 2021·Granted Oct 3, 2023·0 cites·7 claims
- 3064US11609035B2Refrigerant circulating apparatus and method of circulating refrigerantNEC CORP·Filed 2016·Granted Mar 21, 2023·1 cites·7 claims
- 3164US10409345B2Phase change cooling device and phase change cooling methodNEC CORP·Filed 2016·Granted Sep 10, 2019·1 cites·11 claims
- 3262US9727101B2Cooling apparatus and cooling system for electronic-device exhaustionYOSHIKAWA MINORU·Filed 2011·Granted Aug 8, 2017·1 cites·6 claims
- 3362US9456528B2Connecting structure of cooling device, cooling device, and method for connecting cooling deviceNEC CORP·Filed 2013·Granted Sep 27, 2016·1 cites·14 claims
- 3459US2020292221A1Phase-change cooling system and method for controlling the sameNEC CORP·Filed 2020·Application pending·0 cites
- 3558US8511342B2Cooling apparatus of electronic equipmentCHIBA MASAKI·Filed 2008·Granted Aug 20, 2013·2 cites·8 claims
- 3658US2016174417A1Cooling system and method for controlling refrigerant supply volume in cooling systemNEC CORP·Filed 2014·Application pending·0 cites
- 3757US6853071B2Electronic device having dewing prevention structure and dewing prevention structure of electronic deviceNEC CORP·Filed 2002·Granted Feb 8, 2005·7 cites·31 claims
- 3856US11105566B2Heat exchanger, heat exchange system, and heat exchange methodNEC CORP·Filed 2017·Granted Aug 31, 2021·0 cites·10 claims
- 3955US10215456B2Refrigerant distribution device and cooling apparatusNEC CORP·Filed 2014·Granted Feb 26, 2019·0 cites·8 claims
- 4055US9459031B2Cooling apparatus and cooling systemNEC CORP·Filed 2013·Granted Oct 4, 2016·0 cites·19 claims
- 4154US2024142122A1Cooling system and cooling methodNEC CORP·Filed 2022·Application pending·0 cites
- 4254US2015136362A1Heat conveying structure for electronic deviceNEC CORP·Filed 2014·Application pending·0 cites
- 4354US2022341669A1Heat-radiation apparatus and manufacturing method thereofNEC CORP·Filed 2022·Application pending·0 cites
- 4453US11343946B2Cooling system and refrigerant control method for cooling systemNEC CORP·Filed 2017·Granted May 24, 2022·0 cites·10 claims
- 4553US2012263945A1Method for manufacturing flexible glass substrate and flexible glass substrateYOSHIKAWA MINORU·Filed 2009·Application pending·0 cites
- 4653US2022049880A1Heating medium compression apparatus, air conditioner, and heating medium compression methodNEC CORP·Filed 2021·Application pending·0 cites
- 4752US2022074632A1Outdoor unit of air conditionerNEC CORP·Filed 2021·Application pending·0 cites
- 4851US2022074607A1Outdoor unit of air conditionerNEC CORP·Filed 2021·Application pending·0 cites
- 4951US2023213253A1Cooling device and control method for cooling deviceNEC CORP·Filed 2021·Application pending·0 cites
- 5050US2024255201A1Cooling device and control method for cooling deviceNEC CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 108 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →