Inventor · disambiguated record
Ming Zeng
Also filed as: ZENG MING · ZENG MING-HE
29 granted patents·10 pending applications·550 citations·filing 1999–2024
97Inventor score
Files withINTEL CORP15KAWASAKI HEAVY IND LTD14NATIVE VOICE INC2ZENG MING HE2BEIJING SUPERSTRING ACADEMY OF MEMORY TECH1
Top patents by PatentIndex Score
39 records- 0198US6434016B2Apparatus for interconnecting multiple devices on a circuit boardINTEL CORP·Filed 2001·Granted Aug 13, 2002·283 cites·20 claims
- 0292US9929034B2Substrate transfer deviceKAWASAKI HEAVY IND LTD·Filed 2015·Granted Mar 27, 2018·8 cites·9 claims
- 0388USD875267SFacial blemish removing deviceZENG MING HE·Filed 2019·Granted Feb 11, 2020·30 cites·1 claims
- 0486US11335578B2Substrate transfer apparatus and method of measuring positional deviation of substrateKAWASAKI HEAVY IND LTD·Filed 2020·Granted May 17, 2022·2 cites·7 claims
- 0582USD875185SCard delivering toyZENG MING HE·Filed 2018·Granted Feb 11, 2020·21 cites·1 claims
- 0682US10020216B1Robot diagnosing methodKAWASAKI HEAVY IND LTD·Filed 2017·Granted Jul 10, 2018·4 cites·7 claims
- 0778US6243272B1Method and apparatus for interconnecting multiple devices on a circuit boardINTEL CORP·Filed 1999·Granted Jun 5, 2001·46 cites·26 claims
- 0875US11427412B2Substrate conveying robot and substrate conveying methodKAWASAKI HEAVY IND LTD·Filed 2019·Granted Aug 30, 2022·2 cites·9 claims
- 0974US10549427B1Substrate transfer robotKAWASAKI HEAVY IND LTD·Filed 2018·Granted Feb 4, 2020·3 cites·8 claims
- 1073US6417462B1Low cost and high speed 3-load printed wiring board bus topologyINTEL CORP·Filed 2000·Granted Jul 9, 2002·15 cites·11 claims
- 1169US6561410B2Low cost and high speed 3 load printed wiring board bus topologyINTEL CORP·Filed 2002·Granted May 13, 2003·7 cites·20 claims
- 1268US2024005927A1Methods and systems for audio voice service in an embedded deviceNATIVE VOICE INC·Filed 2023·Application pending·0 cites
- 1363US10014205B2Substrate conveyance robot and operating method thereofKAWASAKI HEAVY IND LTD·Filed 2015·Granted Jul 3, 2018·1 cites·10 claims
- 1463US6356115B1Charge sharing and charge recycling for an on-chip busINTEL CORP·Filed 1999·Granted Mar 12, 2002·18 cites·28 claims
- 1562US10381257B2Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical directionKAWASAKI HEAVY IND LTD·Filed 2015·Granted Aug 13, 2019·1 cites·26 claims
- 1660US6373715B1Orienting multiple processors on two sides of a printed circuit boardINTEL CORP·Filed 1999·Granted Apr 16, 2002·21 cites·16 claims
- 1760US2025237742A1Personnel detection method via millimeter-wave radars, electronic device and computer readable storage mediumNANNING FULIAN FUGUI PREC INDUSTRIAL CO LTD·Filed 2024·Application pending·0 cites
- 1859US6970029B2Variable-delay signal generators and methods of operation thereforINTEL CORP·Filed 2003·Granted Nov 29, 2005·13 cites·27 claims
- 1959US6601196B1Method and apparatus for debugging ternary and high speed bussesINTEL CORP·Filed 2000·Granted Jul 29, 2003·8 cites·27 claims
- 2058US2025214245A1Substrate transfer apparatus and method of calibrating substrate transfer apparatusKAWASAKI HEAVY IND LTD·Filed 2023·Application pending·0 cites
- 2158US2021383811A1Methods and systems for audio voice service in an embedded deviceNATIVE VOICE INC·Filed 2020·Application pending·0 cites
- 2257US11926039B2RobotKAWASAKI HEAVY IND LTD·Filed 2020·Granted Mar 12, 2024·0 cites·10 claims
- 2356US2024290678A1Semiconductor structure and method for preparing same, memory, and electronic deviceBEIJING SUPERSTRING ACADEMY OF MEMORY TECH·Filed 2023·Application pending·0 cites
- 2454US2014324487A1Method, apparatus, and system for business processingTENCENT TECH SHENZHEN CO LTD·Filed 2013·Application pending·0 cites
- 2551US2018151399A1Substrate transfer deviceKAWASAKI HEAVY IND LTD·Filed 2018·Application pending·0 cites
- 2650US6507219B2Charge sharing and charge recycling for an on-chip busINTEL CORP·Filed 2001·Granted Jan 14, 2003·5 cites·27 claims
- 2749US6704277B1Testing for digital signalingINTEL CORP·Filed 1999·Granted Mar 9, 2004·17 cites·39 claims
- 2848US10636693B2Substrate transfer device and control method thereforKAWASAKI HEAVY IND LTD·Filed 2018·Granted Apr 28, 2020·0 cites·6 claims
- 2948US9002504B2Method of wafer system interlock for the protection of equipment and product in semiconductor processing bridge toolKAWASAKI ROBOTICS USA INC·Filed 2013·Granted Apr 7, 2015·1 cites·22 claims
- 3048US6417688B1Method and apparatus for implementing a highly robust, fast, and economical five load bus topology based on bit mirroring and a well terminated transmission environmentINTEL CORP·Filed 1999·Granted Jul 9, 2002·13 cites·14 claims
- 3147US6278312B1Method and apparatus for generating a reference voltage signal derived from complementary signalsINTEL CORP·Filed 1999·Granted Aug 21, 2001·21 cites·19 claims
- 3245US6624717B2Impedance matched bus traces over de-gassing holesINTEL CORP·Filed 2001·Granted Sep 23, 2003·2 cites·5 claims
- 3344US2016114457A1Uniform polishing with fixed abrasive padGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Application pending·0 cites
- 3443US6670558B2Inline and “Y” input-output bus topologyINTEL CORP·Filed 2001·Granted Dec 30, 2003·1 cites·3 claims
- 3541US2020070349A1Robot and method of adjusting original position of robotKAWASAKI HEAVY IND LTD·Filed 2018·Application pending·0 cites
- 3641US2019013326A1Composite substrate of three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Application pending·0 cites
- 3740US11207775B2Method of teaching robotKAWASAKI HEAVY IND LTD·Filed 2017·Granted Dec 28, 2021·0 cites·5 claims
- 3835US6777975B1Input-output bus interface to bridge different process technologiesINTEL CORP·Filed 1999·Granted Aug 17, 2004·7 cites·12 claims
- 3931US10403539B2Robot diagnosing methodKAWASAKI HEAVY IND LTD·Filed 2017·Granted Sep 3, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →