Inventor · disambiguated record
Michael Zernack
Also filed as: ZERNACK MICHAEL
2 granted patents·1 pending application·3 citations·filing 2013–2020
38Inventor score
Files withNXP BV3
Top patents by PatentIndex Score
3 records- 0169US8895363B2Die preparation for wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 25, 2014·3 cites·6 claims
- 0240US10347534B2Variable stealth laser dicing processNXP BV·Filed 2017·Granted Jul 9, 2019·0 cites·16 claims
- 0340US2021305095A1Method for forming a packaged semiconductor deviceNXP BV·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →