Inventor · disambiguated record
Motoo Asai
Also filed as: ASAI MOTOO
115 granted patents·7 pending applications·4,108 citations·filing 1989–2015
99Inventor score
Top patents by PatentIndex Score
122 records- 0199US7307852B2Printed circuit board and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Dec 11, 2007·82 cites·21 claims
- 0299US6876554B1Printing wiring board and method of producing the same and capacitor to be contained in printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 5, 2005·160 cites·4 claims
- 0399US6828510B1Multilayer printed wiring board and method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Dec 7, 2004·176 cites·21 claims
- 0499US6724638B1Printed wiring board and method of producing the sameIBIDEN CO LTD·Filed 2000·Granted Apr 20, 2004·249 cites·10 claims
- 0599US6534723B1Multilayer printed-circuit board and semiconductor deviceIBIDEN CO LTD·Filed 2000·Granted Mar 18, 2003·316 cites·28 claims
- 0698US7978478B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jul 12, 2011·46 cites·8 claims
- 0798US7622183B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2006·Granted Nov 24, 2009·52 cites·38 claims
- 0898US5055321AAdhesive for electroless plating, printed circuit boards and method of producing the sameIBIDEN CO LTD·Filed 1989·Granted Oct 8, 1991·152 cites·8 claims
- 0997US7342803B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Mar 11, 2008·92 cites·20 claims
- 1097US6376052B1Multilayer printed wiring board and its production process, resin composition for filling through-holeIBIDEN CO LTD·Filed 2000·Granted Apr 23, 2002·117 cites·55 claims
- 1197US6217987B1Solder resist composition and printed circuit boardsIBIDEN CO LTD·Filed 1997·Granted Apr 17, 2001·160 cites·33 claims
- 1296US7855894B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Dec 21, 2010·26 cites·12 claims
- 1396US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 1496US7070207B2Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communicationIBIDEN CO LTD·Filed 2003·Granted Jul 4, 2006·80 cites·68 claims
- 1596US6392898B1Package substrateIBIDEN CO LTD·Filed 1998·Granted May 21, 2002·82 cites·3 claims
- 1695US8830691B2Printed circuit board and method of manufacturing printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Sep 9, 2014·12 cites·28 claims
- 1795US7995352B2Printed circuit boardIBIDEN CO LTD·Filed 2010·Granted Aug 9, 2011·11 cites·18 claims
- 1895US7864542B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Jan 4, 2011·21 cites·14 claims
- 1995US6411519B2Package substrateIBIDEN CO LTD·Filed 2001·Granted Jun 25, 2002·56 cites·4 claims
- 2095US5175060ALeadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the sameIBIDEN CO LTD·Filed 1990·Granted Dec 29, 1992·231 cites·12 claims
- 2194US8018045B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Sep 13, 2011·18 cites·23 claims
- 2294US7361849B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Apr 22, 2008·16 cites·6 claims
- 2394US6376049B1Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-holeIBIDEN CO LTD·Filed 1990·Granted Apr 23, 2002·82 cites·86 claims
- 2493US7985930B2Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Jul 26, 2011·30 cites·28 claims
- 2593US7535095B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted May 19, 2009·59 cites·13 claims
- 2693US7437030B2Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboardIBIDEN CO LTD·Filed 2006·Granted Oct 14, 2008·25 cites·9 claims
- 2793US6490170B2Package substrateIBIDEN CO LTD·Filed 2001·Granted Dec 3, 2002·41 cites·2 claims
- 2893US5519177AAdhesives, adhesive layers for electroless plating and printed circuit boardsIBIDEN CO LTD·Filed 1994·Granted May 21, 1996·73 cites·68 claims
- 2992US8331102B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Dec 11, 2012·14 cites·19 claims
- 3092US8116091B2Printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Feb 14, 2012·7 cites·22 claims
- 3192US7881069B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 1, 2011·13 cites·14 claims
- 3292US7071424B1Multilayer printed wiring board having filled-via structureIBIDEN CO LTD·Filed 1999·Granted Jul 4, 2006·53 cites·30 claims
- 3392US6835895B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1997·Granted Dec 28, 2004·48 cites·29 claims
- 3492US6365843B1Multilayer printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Apr 2, 2002·85 cites·21 claims
- 3591US8288665B2Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit boardASAI MOTOO·Filed 2010·Granted Oct 16, 2012·7 cites·26 claims
- 3691US8283573B2Multi-layer printed circuit board and method of manufacturing multilayer printed circuit boardASAI MOTOO·Filed 2010·Granted Oct 9, 2012·7 cites·16 claims
- 3791US8020291B2Method of manufacturing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Sep 20, 2011·13 cites·10 claims
- 3891US7729570B2Photoelectric circuit board and device for optical communicationIBIDEN CO LTD·Filed 2007·Granted Jun 1, 2010·23 cites·27 claims
- 3991US6609297B1Method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Aug 26, 2003·59 cites·8 claims
- 4091US6487088B2Package substrateIBIDEN CO LTD·Filed 2001·Granted Nov 26, 2002·33 cites·6 claims
- 4191US6010768AMultilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1997·Granted Jan 4, 2000·74 cites·15 claims
- 4290US8780573B2Printed circuit boardINAGAKI YASUSHI·Filed 2012·Granted Jul 15, 2014·6 cites·20 claims
- 4390US8745863B2Method of manufacturing multi-layer printed circuit boardASAI MOTOO·Filed 2011·Granted Jun 10, 2014·6 cites·20 claims
- 4490US8249402B2Multilayer printed circuit boardASAI MOTOO·Filed 2010·Granted Aug 21, 2012·12 cites·21 claims
- 4589US8120040B2Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communicationASAI MOTOO·Filed 2010·Granted Feb 21, 2012·10 cites·30 claims
- 4689US8006377B2Method for producing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·9 cites·13 claims
- 4789US7864543B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jan 4, 2011·9 cites·8 claims
- 4889US7737366B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2008·Granted Jun 15, 2010·11 cites·7 claims
- 4989US6251502B1Multilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1999·Granted Jun 26, 2001·58 cites·9 claims
- 5088US8107253B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Jan 31, 2012·9 cites·16 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →