Inventor · disambiguated record
Mohit Bhatia
Also filed as: BHATIA MOHIT
7 granted patents·4 pending applications·18 citations·filing 2020–2023
77Inventor score
Technology areasH10W
Files withINTEL CORP11
Top patents by PatentIndex Score
11 records- 0197US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0296US11373972B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jun 28, 2022·9 cites·18 claims
- 0394US12412842B2Microelectronic structures including bridgesINTEL CORP·Filed 2023·Granted Sep 9, 2025·2 cites·20 claims
- 0464US11735558B2Microelectronic structures including bridgesINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·16 claims
- 0562US11804441B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Oct 31, 2023·0 cites·12 claims
- 0656US2025006695A1Packaging architecture including compensation layers for wafer-scale known-good-die to known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 0752US2025006651A1Slit fiducials for integrated circuit device alignmentINTEL CORP·Filed 2023·Application pending·0 cites
- 0852US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 0951US11887962B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jan 30, 2024·0 cites·7 claims
- 1051US11791274B2Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnectsINTEL CORP·Filed 2020·Granted Oct 17, 2023·0 cites·17 claims
- 1148US2024006358A1Substrate trench for improved hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mohit Bhatia files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →