Inventor · disambiguated record
Mohd Muhaiyiddin Bin Abdullah
Also filed as: BIN ABDULLAH MOHD MUHAIYIDDIN
3 granted patents·2 pending applications·4 citations·filing 2015–2020
58Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0181US10356902B2Board to board interconnectINTEL CORP·Filed 2015·Granted Jul 16, 2019·3 cites·10 claims
- 0272US10772206B2Board to board interconnectINTEL CORP·Filed 2019·Granted Sep 8, 2020·1 cites·4 claims
- 0367US11304299B2Board to board interconnectINTEL CORP·Filed 2020·Granted Apr 12, 2022·0 cites·24 claims
- 0439US2021183758A1Conductive polygon power and ground interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Application pending·0 cites
- 0528US2017289410A1Device, system and method to mitigate loss of signal integrity in a communication of image informationINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →