Inventor · disambiguated record

Moo-Jin Jung

Also filed as: JUNG MOO-JIN

1 granted patent·34 citations·filing 2000–2000

46Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0177US6552438B2Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 22, 2003·34 cites·29 claims

Join the waitlist — get patent alerts

Get an alert when Moo-Jin Jung files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →