Inventor · disambiguated record
Mohammad Enamul Kabir
Also filed as: KABIR MOHAMMAD · KABIR MOHAMMAD ENAMUL
10 granted patents·21 pending applications·16 citations·filing 2020–2025
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
31 records- 0197US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0297US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0395US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 0489US12199018B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Jan 14, 2025·2 cites·20 claims
- 0584US12014996B2Moisture hermetic guard ring for semiconductor on insulator devicesINTEL CORP·Filed 2020·Granted Jun 18, 2024·2 cites·12 claims
- 0675US2024355768A1Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2024·Application pending·0 cites
- 0774US12406945B2Moisture hermetic guard ring for semiconductor on insulator devicesINTEL CORP·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0859US2024347590A1Methods and apparatus to reduce stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025079392A1Hybrid bonding interconnect (hbi) architectures and methods for scalabilityINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US12438102B2Hermetic barrier surrounding a plurality of diesINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 1154US12347807B2Inorganic fill material for stacked die assemblyINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·10 claims
- 1254US2024063202A1Package architecture with integrated capacitors in quasi-monolithic chip layersINTEL CORP·Filed 2022·Application pending·0 cites
- 1353US12469801B2Moisture seal coating of hybrid bonded stacked die package assemblyINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·18 claims
- 1452US2025273613A1Methods and apparatus to improve reliability of multi-layer viasINTEL CORP·Filed 2025·Application pending·0 cites
- 1552US2024421101A1Backside contact based die edge guard ringsINTEL CORP·Filed 2023·Application pending·0 cites
- 1652US2024063071A1Inorganic material deposition for inter-die fill in multi-chip composite structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 1751US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2024063072A1Laser assisted etching of dielectrics in ic devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1950US12266682B2Capacitors and resistors at direct bonding interfaces in microelectronic assembliesINTEL CORP·Filed 2020·Granted Apr 1, 2025·0 cites·22 claims
- 2050US2024063076A1Integrated conformal thermal heat spreader for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2150US2024063089A1Thermal management of base dies in multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2250US2024063143A1Device, method, and system to mitigate warpage of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2024063180A1Ic die composites with inorganic inter-die fill structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2450US2024063147A1Device, method, and system to protect through-dielectric vias of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2548US2022199546A1Shield structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Application pending·0 cites
- 2648US2024363490A1Through-silicon via dieINTEL CORP·Filed 2023·Application pending·0 cites
- 2748US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2847US2022192042A1Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Application pending·0 cites
- 2947US2023197538A1Hermetic seal for transistors with metal on both sidesINTEL CORP·Filed 2021·Application pending·0 cites
- 3046US2023207413A1Enhanced heat transfer for integrated circuitsKABIR MOHAMMAD ENAMUL·Filed 2021·Application pending·0 cites
- 3146US2024145383A1Integrated ring structuresINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →