Inventor · disambiguated record
Moo Seong Kim
Also filed as: KIM MOO SEONG
14 granted patents·12 pending applications·4 citations·filing 2012–2025
83Inventor score
Top patents by PatentIndex Score
26 records- 0178US2024298410A1Circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2024·Application pending·0 cites
- 0275US2025185161A1Circuit board including a buffer layer for improvingLG INNOTEK CO LTD·Filed 2025·Application pending·0 cites
- 0371US12256489B2Circuit board including a buffer layer for improvingLG INNOTEK CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·15 claims
- 0471US12016128B2Circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·16 claims
- 0564US12376229B2Resin coated copper and circuit board including the sameLG INNOTEK CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·16 claims
- 0660US12228837B2Electrophoretic particle and light route control member having the sameLG INNOTEK CO LTD·Filed 2020·Granted Feb 18, 2025·0 cites·18 claims
- 0760US9525030B2Semiconductor device and method for growing semiconductor crystalHWANG MIN YOUNG·Filed 2012·Granted Dec 20, 2016·2 cites·9 claims
- 0857US9202764B2Apparatus and method for removing defectKIM MOO SEONG·Filed 2012·Granted Dec 1, 2015·1 cites·11 claims
- 0955US12048095B2Circuit boardLG INNOTEK CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·19 claims
- 1053US12402247B2Circuit boardLG INNOTEK CO LTD·Filed 2021·Granted Aug 26, 2025·0 cites·10 claims
- 1152US9657394B2Hot plate and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2012·Granted May 23, 2017·1 cites·11 claims
- 1250US11464117B2Printed circuit board and manufacturing method thereforLG INNOTEK CO LTD·Filed 2018·Granted Oct 4, 2022·0 cites·17 claims
- 1348US2025040032A1Circuit boardLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 1448US2024043654A1Resin composition for semiconductor package and resin coated copper comprising sameLG INNOTEK CO LTD·Filed 2021·Application pending·0 cites
- 1548US2024120243A1Circuit board and package substrate comprising sameLG INNOTEK CO LTD·Filed 2021·Application pending·0 cites
- 1643US2025331098A1Circuit boardLG INNOTEK CO LTD·Filed 2022·Application pending·0 cites
- 1741US9745667B2Method of fabricating waferKANG SEOK MIN·Filed 2012·Granted Aug 29, 2017·0 cites·18 claims
- 1838US9281189B2Wafer and method of fabricating the sameKIM MOO SEONG·Filed 2012·Granted Mar 8, 2016·0 cites·18 claims
- 1938US2014353684A1Silicon carbide epitaxial wafer and method for fabricating the sameLG INNOTEK CO LTD·Filed 2012·Application pending·0 cites
- 2038US2014284628A1Wafer and method of fabricating the sameLG INNOTEK CO LTD·Filed 2012·Application pending·0 cites
- 2137US9281188B2Apparatus and method for fabricating waferKANG SEOK MIN·Filed 2012·Granted Mar 8, 2016·0 cites·5 claims
- 2235US9269776B2Semiconductor device and method for growing semiconductor crystalKIM MOO SEONG·Filed 2012·Granted Feb 23, 2016·0 cites·16 claims
- 2335US2014130742A1Apparatus and method for depositionKANG SEOK MIN·Filed 2012·Application pending·0 cites
- 2433US2014154423A1Apparatus and method for depositionJO YEONG DEUK·Filed 2012·Application pending·0 cites
- 2532US2014137799A1Deposition apparatus and method of forming thin filmL G INNOTEK CO LTD·Filed 2012·Application pending·0 cites
- 2629US2014290581A1Deposition apparatusKANG SEOK MIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →