Inventor · disambiguated record
Moon Il Kim
Also filed as: KIM MOON-IL
22 granted patents·20 pending applications·93 citations·filing 2005–2023
93Inventor score
Files withSAMSUNG ELECTRO MECH25SAMSUNG ELECTRONICS CO LTD5HAN KYUNG-JIN2KIM MOON IL2KOREA ADVANCED INST SCI & TECH2
Top patents by PatentIndex Score
42 records- 0196US9853003B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 26, 2017·31 cites·20 claims
- 0292US7697301B2Printed circuit board having embedded electronic components and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 13, 2010·21 cites·8 claims
- 0388US7947906B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 24, 2011·19 cites·15 claims
- 0485US10811328B1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 20, 2020·4 cites·20 claims
- 0579US10304791B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Granted May 28, 2019·2 cites·4 claims
- 0679US10020272B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 10, 2018·2 cites·13 claims
- 0777US8482890B2PCB strip and manufacturing method for electronic component embedded PCBKIM MOON-IL·Filed 2010·Granted Jul 9, 2013·6 cites·8 claims
- 0875US9543076B2Electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 10, 2017·2 cites·12 claims
- 0973US10177100B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 8, 2019·2 cites·15 claims
- 1067US10347613B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·1 cites·20 claims
- 1163US11842956B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 1262US9357646B2Package substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted May 31, 2016·1 cites·13 claims
- 1362US8011086B2Method of manufacturing a component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 6, 2011·2 cites·5 claims
- 1459US2021277048A1Method of preparing nuclease-resistant dna-inorganic hybrid nanoflowersKOREA ADVANCED INST SCI & TECH·Filed 2021·Application pending·0 cites
- 1558US11075152B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 1658US10734335B2Electronic component packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·6 claims
- 1750US2024022000A1Terahertz band beamforming antenna systemUNIV KOREA RES & BUS FOUND·Filed 2023·Application pending·0 cites
- 1850US2009071705A1Printed circuit board having embedded components and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1949US2009277673A1PCB having electronic components embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2048US8929091B2Method of manufacturing a printed circuit board (PCB)HAN KYUNG-JIN·Filed 2011·Granted Jan 6, 2015·0 cites·3 claims
- 2147US11462498B2Semiconductor package including frame in which semiconductor chip is embeddedSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 4, 2022·0 cites·22 claims
- 2247US8184448B2Bare chip embedded PCBHAN KYUNG-JIN·Filed 2007·Granted May 22, 2012·0 cites·4 claims
- 2347US2010154210A1Method of manufacturing a printed circuit board having embedded electronic componentsSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2447US2013170154A1Printed circuit board having embedded capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2546US11037880B2Semiconductor package and antenna module including the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 2645US2012291274A1Printed circuit board having electro-component and manufacturing method thereofLEE JIN-WON·Filed 2012·Application pending·0 cites
- 2745US2010242272A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2845US2012017435A1Method of manufacturing PCB having electronic components embedded thereinSOHN SEUNG HYUN·Filed 2011·Application pending·0 cites
- 2944US10818604B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 27, 2020·0 cites·19 claims
- 3044US2015096789A1Electronic component embedded printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3144US2011116246A1Printed circuit board having electro-component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3244US2008115349A1Method of manufacturing a component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3342US2018319835A1Method of preparing nuclease-resistant dna-inorganic hybrid nanoflowersKOREA ADVANCED INST SCI & TECH·Filed 2018·Application pending·0 cites
- 3442US2008041619A1Component-embedded multilayer printed wiring board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3541US9386701B2Electronic component embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 5, 2016·0 cites·15 claims
- 3641US2013081863A1Substrate with built-in electronic component and method for manufacturing the sameLEE DOO HWAN·Filed 2012·Application pending·0 cites
- 3741US2008174503A1Antenna and electronic equipment having the sameLG ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 3841US2014153204A1Electronic component embedded printing circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3940US2017287796A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 4038US8759021B2Microorganism for quantifying homocysteine, and use thereofPARK HYUN GYU·Filed 2010·Granted Jun 24, 2014·0 cites·5 claims
- 4133US2012160549A1Printed circuit board having embedded electronic component and method of manufacturing the sameKIM MOON IL·Filed 2011·Application pending·0 cites
- 4233US2006189351A1Radio frequency switch deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →