Inventor · disambiguated record
Monsen Liu
Also filed as: LIU MONSEN
31 granted patents·15 pending applications·296 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
46 records- 0198US8975726B2POP structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 10, 2015·140 cites·17 claims
- 0297US9407184B2Energy harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·19 cites·20 claims
- 0396US9431369B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 30, 2016·29 cites·15 claims
- 0496US9396300B2Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·20 cites·20 claims
- 0595US9490167B2Pop structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·12 cites·20 claims
- 0694US9337073B23D shielding case and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 10, 2016·17 cites·20 claims
- 0793US9478474B2Methods and apparatus for forming package-on-packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 25, 2016·18 cites·20 claims
- 0893US9252491B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 2, 2016·11 cites·20 claims
- 0992US9406648B2Power supply arrangement for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·13 cites·20 claims
- 1091US12272629B2Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·2 cites·20 claims
- 1184US12355001B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·19 claims
- 1284US10270172B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
- 1382US11050153B2Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
- 1482US10461799B2Integrated transmitter and receiver front end module, transceiver, and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 29, 2019·4 cites·20 claims
- 1579US2025357300A1Interposers including line-on-via and line-in-via interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1678US2023387961A1Method of using integrated transmitter and receiver front end moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1777US2025323168A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1876US10804953B2Method of using integrated transmitter and receiver front end moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·1 cites·20 claims
- 1976US2024379516A1Hybrid organic and non-organic interposer with embedded component and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2075US2025316658A1Double side integration semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2174US11984668B2Method of embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2274US9767957B2Method of manufacturing a tunable three dimensional inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·3 cites·17 claims
- 2374US2025309090A1Redistribution layer structure with support features and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2473US2025246527A1Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2572US2025087588A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2671US11532868B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 2771US2025316645A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2870US11764823B2Method of using integrated transmitter and receiver front end moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 19, 2023·0 cites·20 claims
- 2970US2025038093A1Interposers including line-on-via and line-in-via interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3069US12368142B2Double side integration semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 3168US12354940B2Redistribution layer structure with support features and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 3268US10872878B2Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 22, 2020·1 cites·20 claims
- 3366US12494436B2Integrated passive device dies and methods of forming and placement of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3463US2025357296A1Capacitor integrated passive device with common grounded through-substrate-via and substrate backside conductor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3561US11289449B2Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 3661US9859778B2Energy harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 3761US2025087589A1Interconnection structure for mult-chip interposer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3857US10622701B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 3954US9985336B2Antenna apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·0 cites·20 claims
- 4054US9843106B2Integrated fan out antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·20 claims
- 4152US10297925B2Semiconductor device including integrated fan out antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·0 cites·20 claims
- 4252US10276401B23D shielding case and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·19 claims
- 4350US2022406723A1Interposer via interconnect shapes with improved performance characteristics and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4447US2018108477A1Tunable three dimensional inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 4547US2023137691A1Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4645US9391350B2RF choke device for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 12, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →