Inventor · disambiguated record
Motoki Nakazawa
Also filed as: NAKAZAWA MOTOKI
7 granted patents·1 pending application·32 citations·filing 2013–2016
81Inventor score
Files withSHINKAWA KK8
Top patents by PatentIndex Score
8 records- 0192US9457421B2Wire-bonding apparatus and method of wire bondingSHINKAWA KK·Filed 2015·Granted Oct 4, 2016·7 cites·9 claims
- 0287US9793236B2Wire-bonding apparatus and method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Oct 17, 2017·7 cites·4 claims
- 0387US9337166B2Wire bonding apparatus and bonding methodSHINKAWA KK·Filed 2013·Granted May 10, 2016·9 cites·10 claims
- 0477US9379086B2Method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Jun 28, 2016·4 cites·4 claims
- 0577US9368471B2Wire-bonding apparatus and method of manufacturing semiconductor deviceSHINKAWA KK·Filed 2015·Granted Jun 14, 2016·3 cites·9 claims
- 0667US9028649B2Semiconductor die pick-up apparatus and method of picking up semiconductor die using the sameSHINKAWA KK·Filed 2013·Granted May 12, 2015·2 cites·19 claims
- 0745US2016163673A1Wire bonding apparatus and bonding methodSHINKAWA KK·Filed 2016·Application pending·0 cites
- 0843US9978713B2Method of manufacturing semiconductor device and wire bonding apparatusSHINKAWA KK·Filed 2016·Granted May 22, 2018·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →