Inventor · disambiguated record
Mohan R. Paruchuri
Also filed as: PARUCHURI MOHAN · PARUCHURI MOHAN R
40 granted patents·4 pending applications·955 citations·filing 1996–2006
98Inventor score
Top patents by PatentIndex Score
44 records- 0195US6250541B1Method of forming interconnections on electronic modulesVISTEON GLOBAL TECH INC·Filed 2000·Granted Jun 26, 2001·100 cites·2 claims
- 0293US5894054AAluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazingFORD MOTOR CO·Filed 1997·Granted Apr 13, 1999·69 cites·12 claims
- 0392US5863493ALead-free solder compositionsFORD MOTOR CO·Filed 1996·Granted Jan 26, 1999·83 cites·8 claims
- 0489US5833921ALead-free, low-temperature solder compositionsFORD MOTOR CO·Filed 1997·Granted Nov 10, 1998·65 cites·1 claims
- 0588US7111883B1Pivotable and interchangeable consoleVISTEON GLOBAL TECH INC·Filed 2006·Granted Sep 26, 2006·37 cites·11 claims
- 0687US6082610AMethod of forming interconnections on electronic modulesFORD MOTOR CO·Filed 1997·Granted Jul 4, 2000·72 cites·12 claims
- 0786US5964395APredeposited transient phase electronic interconnect mediaFORD MOTOR CO·Filed 1997·Granted Oct 12, 1999·59 cites·4 claims
- 0884US5928404AElectrical solder and method of manufacturingFORD MOTOR CO·Filed 1997·Granted Jul 27, 1999·49 cites·6 claims
- 0982US6601296B1Multi-shot injection molding process for making electrical connectors and three-dimensional circuitsVISTEON GLOBAL TECH INC·Filed 1999·Granted Aug 5, 2003·51 cites·15 claims
- 1081US6027575AMetallic adhesive for forming electronic interconnects at low temperaturesFORD MOTOR CO·Filed 1997·Granted Feb 22, 2000·47 cites·6 claims
- 1180US6011313AFlip chip interconnections on electronic modulesFORD MOTOR CO·Filed 1999·Granted Jan 4, 2000·44 cites·1 claims
- 1277US6620545B2ETM based batteryVISTEON GLOBAL TECH INC·Filed 2001·Granted Sep 16, 2003·26 cites·14 claims
- 1373US5755896ALow temperature lead-free solder compositionsFORD MOTOR CO·Filed 1996·Granted May 26, 1998·32 cites·2 claims
- 1470US6360939B1Lead-free electrical solder and method of manufacturingVISTEON GLOBAL TECH INC·Filed 1998·Granted Mar 26, 2002·25 cites·11 claims
- 1569US6852932B2Circuit board with air-bridgeVISTEON GLOBAL TECH INC·Filed 2003·Granted Feb 8, 2005·12 cites·7 claims
- 1667US6998293B2Flip-chip bonding methodVISTEON GLOBAL TECH INC·Filed 2002·Granted Feb 14, 2006·18 cites·10 claims
- 1767US6611429B2Electronic circuit to MG beam grounding methodVISTEON GLOBAL TECH INC·Filed 2001·Granted Aug 26, 2003·14 cites·25 claims
- 1863US6381837B1Method for making an electronic circuit assemblyVISTEON GLOBAL TECH INC·Filed 1998·Granted May 7, 2002·21 cites·7 claims
- 1961US6459041B1Etched tri-layer metal bonding layerVISTEON GLOBAL TECH INC·Filed 2000·Granted Oct 1, 2002·8 cites·5 claims
- 2061US5871690ALow-temperature solder compositionsFORD MOTOR CO·Filed 1997·Granted Feb 16, 1999·19 cites·6 claims
- 2160US6274407B1Method and article for attaching high-operating-temperature electronic componentVISTEON GLOBAL TECH INC·Filed 2000·Granted Aug 14, 2001·8 cites·8 claims
- 2259US6376780B2Method for strengthening air bridge circuitsVISTEON GLOBAL TECH INC·Filed 2001·Granted Apr 23, 2002·6 cites·2 claims
- 2358US6168725B1Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromatesVISTEON GLOBAL TECH INC·Filed 1997·Granted Jan 2, 2001·19 cites·9 claims
- 2456US6658731B1Method for fabricating connectors for interconnecting etched tri-metal circuit structuresVISTEON GLOBAL TECH INC·Filed 2000·Granted Dec 9, 2003·6 cites·8 claims
- 2555US6454878B1Cladded material construction for etched-tri-metal circuitsVISTEON GLOBAL TECH INC·Filed 2000·Granted Sep 24, 2002·5 cites·11 claims
- 2654US6248247B1Method of fortifying an air bridge circuitVISTEON GLOBAL TECH INC·Filed 1998·Granted Jun 19, 2001·16 cites·12 claims
- 2753US7152315B1Method of making a printed circuit boardVISTEON GLOBAL TECH INC·Filed 2004·Granted Dec 26, 2006·4 cites·6 claims
- 2853US6838623B2Electrical circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2002·Granted Jan 4, 2005·4 cites·16 claims
- 2950US6495053B1Electrical circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2000·Granted Dec 17, 2002·4 cites·13 claims
- 3050US6395994B1Etched tri-metal with integrated wire traces for wire bondingVISTEON GLOBAL TECH INC·Filed 2000·Granted May 28, 2002·4 cites·18 claims
- 3148US6601753B2Void-free die attachment method with low melting metalVISTEON GLOBAL TECH INC·Filed 2001·Granted Aug 5, 2003·3 cites·16 claims
- 3246US6826829B2Method for attaching a die with a low melting metalVISTEON GLOBAL TECH INC·Filed 2002·Granted Dec 7, 2004·2 cites·14 claims
- 3346US6623651B2Circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2001·Granted Sep 23, 2003·1 cites·12 claims
- 3446US6144104AHigh-operating-temperature electronic componentVISTEON CORP·Filed 1999·Granted Nov 7, 2000·11 cites·15 claims
- 3540US6729023B2Method for making a multi-layer circuit board assembly having air bridges supported by polymeric materialVISTEON GLOBAL TECH INC·Filed 2001·Granted May 4, 2004·0 cites·10 claims
- 3639US2002000331A1Method for making an electronic circuit assemblyFiled 2001·Application pending·0 cites
- 3738US6475703B2Method for constructing multilayer circuit boards having air bridgesVISTEON GLOBAL TECH INC·Filed 1998·Granted Nov 5, 2002·7 cites·12 claims
- 3838US2001035298A1Circuit board and a method for making the sameFiled 2001·Application pending·0 cites
- 3937US6739041B2Circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2001·Granted May 25, 2004·0 cites·13 claims
- 4037US6613239B2Method for making an electrical circuit boardVISTEON GLOBAL TECH INC·Filed 2001·Granted Sep 2, 2003·0 cites·16 claims
- 4137US2005083655A1Dielectric thermal stack for the cooling of high power electronicsVISTEON GLOBAL TECH INC·Filed 2003·Application pending·0 cites
- 4237US2005092478A1Metal foam heat sinkVISTEON GLOBAL TECH INC·Filed 2003·Application pending·0 cites
- 4335US6673723B2Circuit board and a method for making the sameFiled 2001·Granted Jan 6, 2004·0 cites·15 claims
- 4435US6217783B1Method for strengthening air bridge circuitsVISTEON GLOBAL TECH INC·Filed 1998·Granted Apr 17, 2001·4 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Mohan R. Paruchuri files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →