Inventor · disambiguated record
Mohanraj Prabhugoud
Also filed as: PRABHUGOUD MOHANRAJ
13 granted patents·16 pending applications·17 citations·filing 2014–2024
85Inventor score
Top patents by PatentIndex Score
29 records- 0192US10595439B2Movable heatsink utilizing flexible heat pipesINTEL CORP·Filed 2018·Granted Mar 17, 2020·7 cites·19 claims
- 0288US11449111B2Scalable, high load, low stiffness, and small footprint loading mechanismINTEL CORP·Filed 2018·Granted Sep 20, 2022·6 cites·15 claims
- 0381US12133357B2Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2020·Granted Oct 29, 2024·1 cites·20 claims
- 0479US2025071938A1Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0577US12293956B2Boiling enhancement structures for immersion cooled electronic systemsINTEL CORP·Filed 2021·Granted May 6, 2025·1 cites·24 claims
- 0665US12444664B2Loading frame for high I/O count packaged semiconductor chipSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2020·Granted Oct 14, 2025·0 cites·20 claims
- 0765US11683890B2Reflow grid array to support late attach of componentsINTEL CORP·Filed 2018·Granted Jun 20, 2023·1 cites·24 claims
- 0863US12127363B2Compression mounted technology (CMT) socket retention mechanisms to board or interposerINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·25 claims
- 0962US12176643B2Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigationINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·21 claims
- 1061US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1159US2025291134A1Optical connectors with alignment featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1258US2024133945A1Modular low level contact resistance testing apparatus for processor socketsPRABHUGOUD MOHANRAJ·Filed 2023·Application pending·0 cites
- 1356US10644458B2Shielded interconnect arrayINTEL CORP·Filed 2017·Granted May 5, 2020·1 cites·10 claims
- 1455US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
- 1554US2025004205A1Optical isolators for multi-channel optical interconnectsINTEL CORP·Filed 2023·Application pending·0 cites
- 1654US2025102745A1Robust waveguide alignment mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US12248344B2Technologies for liquid cooling interfacesINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·25 claims
- 1853US2024094476A1Technologies for a pluggable optical connectorINTEL CORP·Filed 2022·Application pending·0 cites
- 1953US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 2052US11656247B2Micro-coaxial wire interconnect architectureINTEL CORP·Filed 2017·Granted May 23, 2023·0 cites·25 claims
- 2152US2025004225A1Technologies for substrate features for a pluggable optical connectorINTEL CORP·Filed 2023·Application pending·0 cites
- 2252US2024027697A1Pluggable optical connector with interfacial alignment featuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2348US2021410328A1Cold plate with protective material to prevent reaction with liquid coolantINTEL CORP·Filed 2021·Application pending·0 cites
- 2447US2021219459A1Two-phase manifold cold plate for liquid coolingINTEL CORP·Filed 2021·Application pending·0 cites
- 2546US11621237B2Interposer and electronic packageINTEL CORP·Filed 2019·Granted Apr 4, 2023·0 cites·23 claims
- 2644US2021183846A1Enhanced integrated circuit component power deliveryINTEL CORP·Filed 2021·Application pending·0 cites
- 2743US2016178663A1Formed wire probe interconnect for test die contactorINTEL CORP·Filed 2014·Application pending·0 cites
- 2842US10324112B2Package testing system and method with contact alignmentINTEL CORP·Filed 2016·Granted Jun 18, 2019·0 cites·18 claims
- 2942US2021345519A1Technologies for reconfigurable heat sinksINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →