Inventor · disambiguated record
Mohammad Mamunur Rahman
Also filed as: RAHMAN MOHAMMAD · RAHMAN MOHAMMAD MAMUNUR
2 granted patents·26 pending applications·0 citations·filing 2019–2024
23Inventor score
Top patents by PatentIndex Score
28 records- 0158US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0258US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0458US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0556US2025107112A1Inductors for semiconductor package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0655US2025112179A1Technologies for a coaxial inductor in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0755US2025379163A1Microelectronic assemblies having a glass layer substrate with integrated capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0853US12074102B2Structural elements for application specific electronic device packagesINTEL CORP·Filed 2020·Granted Aug 27, 2024·0 cites·19 claims
- 0953US2024088199A1Technologies for glass core inductorINTEL CORP·Filed 2022·Application pending·0 cites
- 1053US2024213111A1Configurable micro heat pipe (mhp) and microchannel for improved cooling of glass core substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 1152US2024188212A1Package substrate architectures with improved coolingINTEL CORP·Filed 2022·Application pending·0 cites
- 1252US2024395661A1In-situ micro-fluidic channels for heat dissipation in glass substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1352US2024177918A1Glass embedded true air core inductorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1451US2024312853A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1551US2024312888A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1651US2024120305A1Package architecture with interconnect migration barriersINTEL CORP·Filed 2022·Application pending·0 cites
- 1751US2024162191A1Package substrate with alternating dielectric material layer pairsINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1951US2024063100A1Skip layer with air gap on glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2051US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 2150US2024222286A1Hybrid bonded die-last interconnect architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 2250US2024327201A1Mems dies embedded in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2350US2024203805A1Embedded memory for glass core packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2449US2024178119A1Rbtv improvement for glass core architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 2547US2024363995A1Microelectronic assemblies with integrated glass-based antenna unitsINTEL CORP·Filed 2023·Application pending·0 cites
- 2645US11721650B2Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor packageINTEL CORP·Filed 2019·Granted Aug 8, 2023·0 cites·17 claims
- 2745US2023091720A1Integrated, configurable micro heat pump and microchannelsINTEL CORP·Filed 2021·Application pending·0 cites
- 2845US2023108843A1Integrated, configurable, triangular microchannel heat pumpINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →