Inventor · disambiguated record
Morgan Upshall
Also filed as: UPSHALL MORGAN L · UPSHALL MORGAN LEE
1 granted patent·2 pending applications·2 citations·filing 2004–2007
18Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0136US2008048344A1High performance ic package and methodLYN ROBERT·Filed 2007·Application pending·0 cites
- 0235US7360675B2Wire bonder for ball bonding insulated wire and method of using sameMICROBONDS INC·Filed 2004·Granted Apr 22, 2008·2 cites·9 claims
- 0334US2006175712A1High performance IC package and methodMICROBONDS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →