Inventor · disambiguated record
Mohamad Yazid Bin Wagiman
Also filed as: WAGIMAN MOHAMAD YAZID · WAGIMAN MOHAMAD YAZID BIN
3 granted patents·1 pending application·1 citations·filing 2008–2023
47Inventor score
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0177US11699647B2Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 0248US2023307328A1Pre-molded lead frames for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0342US12199019B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 14, 2025·0 cites·7 claims
- 0438US7875968B2Leadframe, semiconductor package and support lead for bonding with groundwiresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 25, 2011·0 cites·28 claims
Join the waitlist — get patent alerts
Get an alert when Mohamad Yazid Bin Wagiman files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →