Inventor · disambiguated record
Motoyo Wajima
Also filed as: KAWAMOTO MINEO · MURAKAMI KANJI · WAJIMA MOTOYO
37 granted patents·931 citations·filing 1974–1996
98Inventor score
Top patents by PatentIndex Score
37 records- 0193US4642161AMethod of bonding copper and resinHITACHI LTD·Filed 1986·Granted Feb 10, 1987·113 cites·11 claims
- 0291US5021296ACircuit board and process for producing the sameHITACHI LTD·Filed 1989·Granted Jun 4, 1991·66 cites·33 claims
- 0389US4526835AMulti-layer printed circuit board and process for production thereofHITACHI LTD·Filed 1983·Granted Jul 2, 1985·45 cites·35 claims
- 0487US4099974AElectroless copper solutionHITACHI LTD·Filed 1976·Granted Jul 11, 1978·35 cites·8 claims
- 0585US4604160AMethod for manufacture of printed wiring boardHITACHI LTD·Filed 1985·Granted Aug 5, 1986·87 cites·18 claims
- 0684US4661417AComposite of metal and resin having electrolytically reduced metal layer and process for producing the sameHITACHI LTD·Filed 1984·Granted Apr 28, 1987·43 cites·40 claims
- 0783US4710854AHybrid multilayer wiring boardHITACHI LTD·Filed 1987·Granted Dec 1, 1987·46 cites·13 claims
- 0882US4585841ATransparent resin material containing metallic atoms bonded to pendent carboxylic acid groupsHITACHI LTD·Filed 1983·Granted Apr 29, 1986·30 cites·30 claims
- 0982US4393188AThermosetting prepolymer from polyfunctional maleimide and bis maleimideHITACHI CHEMICAL CO LTD·Filed 1981·Granted Jul 12, 1983·38 cites·8 claims
- 1081US4820549APhoto-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin compositionHITACHI LTD·Filed 1987·Granted Apr 11, 1989·29 cites·3 claims
- 1180US5028513AProcess for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Jul 2, 1991·40 cites·21 claims
- 1280US4151313AMethod for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking materialHITACHI LTD·Filed 1978·Granted Apr 24, 1979·26 cites·7 claims
- 1375US5472563APrinted circuit board and method and apparatus for making sameHITACHI LTD·Filed 1994·Granted Dec 5, 1995·40 cites·14 claims
- 1471US5113477APlastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomersHITACHI LTD·Filed 1990·Granted May 12, 1992·20 cites·11 claims
- 1568US5768108AMulti-layer wiring structureHITACHI LTD·Filed 1996·Granted Jun 16, 1998·35 cites·16 claims
- 1668US4752641AThermosetting resin composition and prepolymer obtained therefromHITACHI LTD·Filed 1987·Granted Jun 21, 1988·18 cites·15 claims
- 1768US4457952AProcess for producing printed circuit boardsHITACHI LTD·Filed 1983·Granted Jul 3, 1984·24 cites·10 claims
- 1865US4239813AProcess for forming printed wiring by electroless depositionHITACHI LTD·Filed 1979·Granted Dec 16, 1980·16 cites·8 claims
- 1963US4784917AThermosetting resin composition and laminate and process for the production thereofHITACHI LTD·Filed 1986·Granted Nov 15, 1988·18 cites·8 claims
- 2060US4343659AProcess for producing copper barrier type, nuclear fuel claddingHITACHI LTD·Filed 1980·Granted Aug 10, 1982·10 cites·13 claims
- 2159US4632852AProcess for electroless copper platingHITACHI LTD·Filed 1985·Granted Dec 30, 1986·20 cites·31 claims
- 2259US4448940AThermosetting resin composition and prepolymer thereofHITACHI LTD·Filed 1982·Granted May 15, 1984·12 cites·16 claims
- 2357US4378384AProcess for producing printed circuit board by electroless platingHITACHI LTD·Filed 1981·Granted Mar 29, 1983·16 cites·20 claims
- 2457US4283522AProcess for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimideHITACHI CHEMICAL CO LTD·Filed 1979·Granted Aug 11, 1981·10 cites·10 claims
- 2554US4346206AImide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixtureHITACHI CHEMICAL CO LTD·Filed 1980·Granted Aug 24, 1982·13 cites·3 claims
- 2653US4610910APrinted circuit board, process for preparing the same and resist ink used thereforHITACHI LTD·Filed 1984·Granted Sep 9, 1986·11 cites·14 claims
- 2752US4933228AThermosetting resin and prepreg and laminate using the sameHITACHI LTD·Filed 1989·Granted Jun 12, 1990·9 cites·2 claims
- 2852US3984373AThermosetting resin compositionHITACHI LTD·Filed 1974·Granted Oct 5, 1976·7 cites·22 claims
- 2951US4482703AThermosetting resin composition comprising dicyanamide and polyvalent imideHITACHI LTD·Filed 1982·Granted Nov 13, 1984·7 cites·7 claims
- 3051US4296219ABismide-ether compounds, compositions thereof, and method of producing sameHITACHI LTD·Filed 1979·Granted Oct 20, 1981·7 cites·40 claims
- 3149US4486583AHeat-resistant resin from aromatic cyanamide compound and aromatic amine compoundHITACHI LTD·Filed 1983·Granted Dec 4, 1984·9 cites·13 claims
- 3242US4607094AThermosetting resin composition from aromatic cyanamideHITACHI LTD·Filed 1985·Granted Aug 19, 1986·4 cites·8 claims
- 3340US4400438AProcess for producing fire retardant and heat resistant copper-clad laminated board, and varnish thereforHITACHI CHEMICAL CO LTD·Filed 1981·Granted Aug 23, 1983·10 cites·3 claims
- 3439US4886858AThermosetting resin and prepreg and laminate using the sameHITACHI LTD·Filed 1987·Granted Dec 12, 1989·5 cites·6 claims
- 3536US4546168AThermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compoundHITACHI LTD·Filed 1984·Granted Oct 8, 1985·2 cites·8 claims
- 3635US4738900AThermo-setting, polymerizable composition and wiring boardHITACHI LTD·Filed 1986·Granted Apr 19, 1988·6 cites·14 claims
- 3735US4587162AResin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivativeHITACHI LTD·Filed 1985·Granted May 6, 1986·4 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →