Inventor · disambiguated record
Muhannad Bakir
Also filed as: BAKIR MUHANNAD · BAKIR MUHANNAD S
18 granted patents·7 pending applications·290 citations·filing 2001–2024
94Inventor score
Top patents by PatentIndex Score
25 records- 0194US7928563B23-D ICs with microfluidic interconnects and methods of constructing sameGEORGIA TECH RES INST·Filed 2008·Granted Apr 19, 2011·41 cites·20 claims
- 0293US8546930B23-D ICs equipped with double sided power, coolant, and data featuresBAKIR MUHANNAD S·Filed 2010·Granted Oct 1, 2013·38 cites·20 claims
- 0390US7266267B2Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereofGEORGIA TECH RES INST·Filed 2005·Granted Sep 4, 2007·14 cites·52 claims
- 0489US7135777B2Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2003·Granted Nov 14, 2006·49 cites·29 claims
- 0586US6690081B2Compliant wafer-level packaging devices and methods of fabricationGEORGIA TECH RES INST·Filed 2001·Granted Feb 10, 2004·44 cites·54 claims
- 0685US8563365B2Air-gap C4 fluidic I/O interconnects and methods of fabricating sameKING JR CALVIN RICHARD·Filed 2012·Granted Oct 22, 2013·19 cites·20 claims
- 0781US6788867B2Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationGEORGIA TECH RES INST·Filed 2003·Granted Sep 7, 2004·21 cites·19 claims
- 0880US6785458B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2002·Granted Aug 31, 2004·19 cites·13 claims
- 0978US7468558B2Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereofGEORGIA TECH RES INST·Filed 2006·Granted Dec 23, 2008·7 cites·29 claims
- 1074US7099525B2Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereofGEORGIA TECH RES INST·Filed 2003·Granted Aug 29, 2006·15 cites·88 claims
- 1173US10330874B2Mixed-signal substrate with integrated through-substrate viasGEORGIA TECH RES INST·Filed 2017·Granted Jun 25, 2019·2 cites·18 claims
- 1269US6954576B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2004·Granted Oct 11, 2005·9 cites·10 claims
- 1368US2024347502A1Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the sameUNIV CALIFORNIA·Filed 2024·Application pending·0 cites
- 1463US12027488B2Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the sameUNIV CALIFORNIA·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 1556US7132736B2Devices having compliant wafer-level packages with pillars and methods of fabricationGEORGIA TECH RES INST·Filed 2002·Granted Nov 7, 2006·7 cites·6 claims
- 1655US2024350059A1Digital SuturesUNIV EMORY·Filed 2022·Application pending·0 cites
- 1755US2025316656A1Stitch-chip architectures with microinterconnects for chiplets and related devicesGEORGIA TECH RES INST·Filed 2023·Application pending·0 cites
- 1853US7798817B2Integrated circuit interconnects with coaxial conductorsGEORGIA TECH RES INST·Filed 2006·Granted Sep 21, 2010·1 cites·15 claims
- 1950US7554347B2High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of useGEORGIA TECH RES INST·Filed 2003·Granted Jun 30, 2009·4 cites·28 claims
- 2040US2004184704A1Curved metal-polymer dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and uses thereofFiled 2003·Application pending·0 cites
- 2139US2003012539A1Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabricationFiled 2002·Application pending·0 cites
- 2237US10636731B2Mechanically flexible interconnects, methods of making the same, and methods of useGEORGIA TECH RES INST·Filed 2016·Granted Apr 28, 2020·0 cites·20 claims
- 2337US2005257709A1Systems and methods for three-dimensional lithography and nano-indentationMULE TONY·Filed 2003·Application pending·0 cites
- 2433US8803509B2Modular nano and microscale sensorsRAVINDRAN RAMASAMY·Filed 2011·Granted Aug 12, 2014·0 cites·20 claims
- 2530US2018294211A1Vertically curved mechanically flexible interconnects, methods of making the same, and methods of useGEORGIA TECH RES INST·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →