Inventor · disambiguated record
Mu-Hsuan Chan
Also filed as: CHAN MU-HSUAN
13 granted patents·4 pending applications·6 citations·filing 2008–2024
83Inventor score
Top patents by PatentIndex Score
17 records- 0174US8952537B2Conductive bump structure with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 10, 2015·3 cites·8 claims
- 0273US9899303B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·11 claims
- 0364US9087780B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 0458US2025273622A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0556US2024373545A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0655US2025309539A1Antenna substrate, electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0751US10403567B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 0849US9418874B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·9 claims
- 0948US9349705B2Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 24, 2016·0 cites·15 claims
- 1047US9768140B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Sep 19, 2017·0 cites·11 claims
- 1144US9754898B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·18 claims
- 1244US9607941B2Conductive via structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
- 1344US8829687B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Sep 9, 2014·0 cites·18 claims
- 1443US9337061B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 1543US8524049B2Method for forming metallic nitride filmLU FU-HSING·Filed 2008·Granted Sep 3, 2013·0 cites·12 claims
- 1637US2015162301A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1736US9515040B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →