Inventor · disambiguated record
Mukta S. Farooq
Also filed as: FAROOQ MUKTA · FAROOQ MUKTA S · FAROOQ MUKTA SHAJI
25 granted patents·1,361 citations·filing 1992–2001
98Inventor score
Files withIBM25
Top patents by PatentIndex Score
25 records- 0198US6072690AHigh k dielectric capacitor with low k sheathed signal viasIBM·Filed 1998·Granted Jun 6, 2000·152 cites·7 claims
- 0296US6178082B1High temperature, conductive thin film diffusion barrier for ceramic/metal systemsIBM·Filed 1998·Granted Jan 23, 2001·129 cites·15 claims
- 0394US6489686B2Multi-cavity substrate structure for discrete devicesIBM·Filed 2001·Granted Dec 3, 2002·58 cites·11 claims
- 0494US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0591US6430030B2High k dielectric material with low k dielectric sheathed signal viasIBM·Filed 2001·Granted Aug 6, 2002·34 cites·4 claims
- 0691US6023407AStructure for a thin film multilayer capacitorIBM·Filed 1998·Granted Feb 8, 2000·80 cites·26 claims
- 0791US5898222ACapped copper electrical interconnectsIBM·Filed 1997·Granted Apr 27, 1999·95 cites·30 claims
- 0889US5549808AMethod for forming capped copper electrical interconnectsIBM·Filed 1995·Granted Aug 27, 1996·113 cites·30 claims
- 0989US5266446AMethod of making a multilayer thin film structureIBM·Filed 1992·Granted Nov 30, 1993·147 cites·25 claims
- 1087US6335210B1Baseplate for chip burn-in and/of testing, and method thereofIBM·Filed 1999·Granted Jan 1, 2002·64 cites·13 claims
- 1183US5912044AMethod for forming thin film capacitorsIBM·Filed 1997·Granted Jun 15, 1999·54 cites·15 claims
- 1281US6200400B1Method for making high k dielectric material with low k dielectric sheathed signal viasIBM·Filed 1999·Granted Mar 13, 2001·34 cites·8 claims
- 1381US5545927ACapped copper electrical interconnectsIBM·Filed 1995·Granted Aug 13, 1996·50 cites·8 claims
- 1479US6216324B1Method for a thin film multilayer capacitorIBM·Filed 1999·Granted Apr 17, 2001·37 cites·36 claims
- 1574US6228682B1Multi-cavity substrate structure for discrete devicesIBM·Filed 1999·Granted May 8, 2001·31 cites·9 claims
- 1673US6339527B1Thin film capacitor on ceramicIBM·Filed 1999·Granted Jan 15, 2002·41 cites·20 claims
- 1764US6461493B1Decoupling capacitor method and structure using metal based carrierIBM·Filed 1999·Granted Oct 8, 2002·23 cites·20 claims
- 1862US6444919B1Thin film wiring scheme utilizing inter-chip site surface wiringIBM·Filed 1995·Granted Sep 3, 2002·29 cites·21 claims
- 1960US5874369AMethod for forming vias in a dielectric filmIBM·Filed 1996·Granted Feb 23, 1999·24 cites·7 claims
- 2060US5705857ACapped copper electrical interconnectsIBM·Filed 1996·Granted Jan 6, 1998·20 cites·5 claims
- 2155US6015955AReworkability solution for wirebound chips using high performance capacitorIBM·Filed 1997·Granted Jan 18, 2000·13 cites·11 claims
- 2253US6210545B1Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite targetIBM·Filed 1999·Granted Apr 3, 2001·15 cites·17 claims
- 2350US6281692B1Interposer for maintaining temporary contact between a substrate and a test bedIBM·Filed 1998·Granted Aug 28, 2001·15 cites·10 claims
- 2447US6255827B1Search routine for 2-point electrical testerIBM·Filed 1999·Granted Jul 3, 2001·14 cites·30 claims
- 2536US6226863B1Reworkability method for wirebond chips using high performance capacitorIBM·Filed 1999·Granted May 8, 2001·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →