Inventor · disambiguated record
Munehisa Mitani
Also filed as: MITANI MUNEHISA
9 granted patents·6 pending applications·19 citations·filing 2012–2017
80Inventor score
Top patents by PatentIndex Score
15 records- 0185US8569792B2Silicone resin sheet, producing method thereof, encapsulating sheet, and light emitting diode deviceMITANI MUNEHISA·Filed 2012·Granted Oct 29, 2013·11 cites·11 claims
- 0278US8551277B2Method for producing light emitting diode deviceOOYABU YASUNARI·Filed 2012·Granted Oct 8, 2013·3 cites·3 claims
- 0373US9351399B2Light-emitting device, light-emitting device assembly, and electrode-bearing substrate in which a fragile region is formed in a substrate, and light emitting device cut from light-emitting device assemblyNITTO DENKO CORP·Filed 2013·Granted May 24, 2016·4 cites·3 claims
- 0461US9024353B2Encapsulating sheet-covered semiconductor element and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted May 5, 2015·1 cites·10 claims
- 0557US11269118B2Optical semiconductor element coating sheetEPISTAR CORP·Filed 2017·Granted Mar 8, 2022·0 cites·8 claims
- 0651US9048401B2Producing method of semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jun 2, 2015·0 cites·8 claims
- 0749US2016284951A1Method for producing optical semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0848US2014024179A1Producing method of semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0944US9214362B2Producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Dec 15, 2015·0 cites·6 claims
- 1044US8575290B2Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheetMITANI MUNEHISA·Filed 2012·Granted Nov 5, 2013·0 cites·5 claims
- 1143US2016087170A1Method and system for producing optical semiconductor device, production condition determination device and production management deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1242US2014091334A1Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereofNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1341US2016035592A1Adhering device and method for producing electronic deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1440US2014091337A1Light-emitting device, light-emitting device assembly, and electrode-bearing substrateNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1536US8883950B2Silicone resin composition, encapsulating material, and light emitting diode deviceKIMURA RYUICHI·Filed 2012·Granted Nov 11, 2014·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →