Inventor · disambiguated record
Muneharu Ohara
Also filed as: OHARA MUNEHARU
6 granted patents·146 citations·filing 1994–1998
85Inventor score
Files withMITSUI MINING & SMELTING CO6
Top patents by PatentIndex Score
6 records- 0187US5482784APrinted circuit inner-layer copper foil and process for producing the sameMITSUI MINING & SMELTING CO·Filed 1994·Granted Jan 9, 1996·63 cites·3 claims
- 0269US5959256AMultilayer printed wiring boardMITSUI MINING & SMELTING CO·Filed 1997·Granted Sep 28, 1999·26 cites·11 claims
- 0363US5674611AAdhesive for copper foils and an adhesive-applied copper foilMITSUI MINING & SMELTING CO·Filed 1995·Granted Oct 7, 1997·22 cites·5 claims
- 0459US5718039AMethod of making multilayer printed wiring boardMITSUI MINING & SMELTING CO·Filed 1995·Granted Feb 17, 1998·20 cites·2 claims
- 0557US5833819ACopper foil for a printed circuit board, a process and an apparatus for producing the sameMITSUI MINING & SMELTING CO·Filed 1996·Granted Nov 10, 1998·11 cites·4 claims
- 0634US5997710ACopper foil for a printed circuit board, a process and an apparatus for producing the sameMITSUI MINING & SMELTING CO·Filed 1998·Granted Dec 7, 1999·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →