Inventor · disambiguated record
Muneo Yamada
Also filed as: YAMADA MUNEO
2 granted patents·26 citations·filing 1993–2020
54Inventor score
Top patents by PatentIndex Score
2 records- 0154US5403785AProcess of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated therebyMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Apr 4, 1995·26 cites·18 claims
- 0249US12103277B2Shock absorbing laminate and display devicePANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 1, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →