Inventor · disambiguated record
Myungdo Cho
Also filed as: CHO MYUNGDO
0 granted patents·8 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0162US2025192019A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0261US2025062240A1Semiconductor package with improved structural stabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0360US2025273577A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0460US2025192013A1Wiring substrate and semiconductor package including a substrate wiring patternSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0559US2025192018A1Semiconductor package including interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0654US2024222280A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0754US2024421034A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0849US2024055338A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →