Inventor · disambiguated record
Myung-Kee Chung
Also filed as: CHUNG MYUNG-KEE
14 granted patents·4 pending applications·715 citations·filing 1998–2024
93Inventor score
Top patents by PatentIndex Score
18 records- 0197US6448661B1Three-dimensional multi-chip package having chip selection pads and manufacturing method thereofSAMSUNG ELECTORNICS CO LTD·Filed 2002·Granted Sep 10, 2002·420 cites·14 claims
- 0295US7064435B2Semiconductor package with improved ball land structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 20, 2006·109 cites·18 claims
- 0389US7588964B2Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 15, 2009·18 cites·13 claims
- 0484US6041495AMethod of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 28, 2000·82 cites·3 claims
- 0582US7807507B2Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·8 cites·19 claims
- 0679US12237309B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 0779US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 0879US6348363B1Method for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 19, 2002·32 cites·19 claims
- 0974US11955464B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1069US10872802B2Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 22, 2020·1 cites·8 claims
- 1168US6245490B1Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 12, 2001·15 cites·10 claims
- 1267US11574892B2Semiconductor package having pads with stepped structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 1355US6207478B1Method for manufacturing semiconductor package of center pad type deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Mar 27, 2001·24 cites·10 claims
- 1451US2008230923A1Chip stack package and method of manufacturing the chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1545US2008092360A1Thin semiconductor chip pickup apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1640US9041181B2Land grid array package capable of decreasing a height difference between a land and a solder resistLEE HEE-CHUL·Filed 2011·Granted May 26, 2015·0 cites·13 claims
- 1737US2002056924A1Semiconductor package having an insulating region on an edge of a chip to prevent shortsFiled 2001·Application pending·0 cites
- 1836US2010314740A1Semiconductor package, stack module, card, and electronic systemSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →