Inventor · disambiguated record
Myoungchul Eum
Also filed as: EUM MYOUNGCHUL
1 granted patent·10 pending applications·0 citations·filing 2022–2025
10Inventor score
Top patents by PatentIndex Score
11 records- 0158US2025259954A1Solder ball, semiconductor package including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0252US2025259860A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0349US2023212440A1Adhesive composition and wafer processing tape including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0447US12354879B2Method of fabricating semiconductor device and method of separating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 0546US2025210448A1Die attach film and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0646US2024096839A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0745US2025132280A1Chip attach film, semiconductor package including the same, and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0840US2024087940A1Wafer temporary adhesive tape, wafer stack structure, and method of processing semiconductor wafer by using the wafer temporary adhesive tapeSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0939US2024120266A1Semiconductor package including conductive antioxidant layerSAMSUNG RO YEONGTONG GU·Filed 2023·Application pending·0 cites
- 1039US2024145417A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1133US2025273482A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →