Inventor · disambiguated record
Myongsuk Kang
Also filed as: KANG MYONGSUK
2 granted patents·3 pending applications·0 citations·filing 2021–2025
27Inventor score
Files withSTATS CHIPPAC PTE LTD5
Top patents by PatentIndex Score
5 records- 0164US2025309172A1Semiconductor Device and Method of Forming an Embedded Redistribution LayerSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0256US11955467B2Semiconductor device and method of forming vertical interconnect structure for PoP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 9, 2024·0 cites·23 claims
- 0355US12354990B2Semiconductor device and method of forming an embedded redistribution layerSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jul 8, 2025·0 cites·24 claims
- 0451US2025022819A1Methods for forming conductive structures between two substratesSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0547US2025087499A1Semiconductor Device and Method of Making a Fine Pitch Organic Interposer with Dual Function Capping LayerSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Myongsuk Kang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →