Inventor · disambiguated record
Myungsung Kang
Also filed as: KANG MYUNGSUNG
4 granted patents·2 pending applications·8 citations·filing 2020–2025
66Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0195US11289438B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·5 cites·20 claims
- 0294US11658141B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·3 cites·20 claims
- 0379US2025364282A1Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0470US12394641B2Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0560US12453087B2Semiconductor device having stacked semiconductor chips interconnected with support structures via TSVSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·18 claims
- 0657US2025226285A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →