Inventor · disambiguated record
Myungsam Kang
Also filed as: KANG MYUNGSAM
36 granted patents·19 pending applications·29 citations·filing 2019–2025
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD55
Top patents by PatentIndex Score
55 records- 0195US11581284B2Semiconductor package with under-bump metal structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·17 claims
- 0293US11935849B2Semiconductor package with an antenna substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·2 cites·20 claims
- 0393US11626367B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·3 cites·13 claims
- 0492US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0590US12334445B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·1 cites·20 claims
- 0690US12261105B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0790US11784129B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·15 claims
- 0890US11527495B2Semiconductor package with an antenna substrateSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 13, 2022·2 cites·20 claims
- 0986US11916002B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 1086US11562966B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·1 cites·20 claims
- 1184US11569158B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 1281US12021020B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 1381US11387225B2Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·1 cites·13 claims
- 1479US12183665B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1578US2025118646A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1677US2025279366A1Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1777US2024347468A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1876US11329014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·2 cites·16 claims
- 1976US11121079B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 2075US12046562B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2175US2024363573A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2274US12394708B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 2374US12062632B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 2474US2025062221A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2572US2025273637A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2668US12094817B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2768US12040297B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 2868US12002798B2Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·9 claims
- 2966US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 3066US11676927B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·19 claims
- 3166US2023075027A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3265US12327826B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 3364US11935847B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·18 claims
- 3464US11842950B2Package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 3563US11837537B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 3661US12159826B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·16 claims
- 3761US2024429153A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3861US2025087637A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3960US2025015065A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4059US11508639B2System in package (SiP) semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 4159US2024321755A1Semiconductor package including glass core substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4258US12278191B2Semiconductor packages having wiring patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·19 claims
- 4357US2024030118A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4455US2025029886A1Semiconductor package including thermal interfacial material patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4555US2020176364A1Package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4655US2023411275A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4755US2024030145A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4854US2025046755A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4953US2023148143A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 5052US12057380B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·17 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Myungsam Kang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →