Inventor · disambiguated record
Myung June Lee
Also filed as: LEE MYUNG JUNE
5 granted patents·1 pending application·50 citations·filing 2010–2015
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US9196575B1Integrated circuit package with cavity in substrateALTERA CORP·Filed 2013·Granted Nov 24, 2015·27 cites·17 claims
- 0287US9607863B1Integrated circuit package with vacant cavityALTERA CORP·Filed 2013·Granted Mar 28, 2017·13 cites·3 claims
- 0379US9330997B1Heat spreading structures for integrated circuitsALTERA CORP·Filed 2014·Granted May 3, 2016·6 cites·17 claims
- 0465US9236341B1Through-silicon vias with metal system fillKIM DONG W·Filed 2010·Granted Jan 12, 2016·3 cites·15 claims
- 0561US9478491B1Integrated circuit package substrate with openings surrounding a conductive viaALTERA CORP·Filed 2014·Granted Oct 25, 2016·1 cites·25 claims
- 0630US2016240457A1Integrated circuit packages with dual-sided stacking structureALTERA CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →