Inventor · disambiguated record
Myung Jun Park
Also filed as: PARK MYUNG JUN
79 granted patents·15 pending applications·237 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
94 records- 0198US11348732B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 31, 2022·5 cites·23 claims
- 0298US11239032B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 1, 2022·6 cites·16 claims
- 0398US10366834B1Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 30, 2019·67 cites·16 claims
- 0497US11587735B2Multilayer electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 21, 2023·8 cites·20 claims
- 0595US11264170B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 1, 2022·3 cites·20 claims
- 0695US10388447B2Multilayer seed pattern inductor, manufacturing method thereof, and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 20, 2019·8 cites·24 claims
- 0794US10614943B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 7, 2020·7 cites·22 claims
- 0891US12170170B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 17, 2024·2 cites·34 claims
- 0991US9087644B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Jul 21, 2015·11 cites·17 claims
- 1091US8941972B2Multilayer ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·9 cites·24 claims
- 1191US8837112B2Multilayer ceramic electronic component and method of fabricating the sameGU HYUN HEE·Filed 2012·Granted Sep 16, 2014·15 cites·12 claims
- 1290US11342123B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 24, 2022·2 cites·12 claims
- 1389US11651899B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2022·Granted May 16, 2023·1 cites·13 claims
- 1489US9424990B2Multilayered ceramic capacitor and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 23, 2016·7 cites·31 claims
- 1587US10861651B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 8, 2020·3 cites·10 claims
- 1687US9214278B2Multilayered ceramic electronic component and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Dec 15, 2015·6 cites·14 claims
- 1786US9251956B2Conductive resin composition and multilayer ceramic capacitor having the sameKANG SUNG KOO·Filed 2012·Granted Feb 2, 2016·6 cites·13 claims
- 1886US8842413B2Multilayered ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Sep 23, 2014·8 cites·5 claims
- 1985US12020869B2Multilayer electronic component having improved electrode structure for increased capacity per unit volumeSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 25, 2024·2 cites·17 claims
- 2085US10319515B2Chip electronic componentSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 11, 2019·3 cites·14 claims
- 2185US9875849B2Multilayer ceramic electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 23, 2018·5 cites·13 claims
- 2284US10886066B2Multilayer ceramic capacitor including external electrode having tin-plated layers alternately stacked with nickel-plated layer(s)SAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 5, 2021·2 cites·26 claims
- 2384US9343235B2Multilayer ceramic capacitor and assembly board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 17, 2016·5 cites·18 claims
- 2483US9159495B2Multilayer ceramic electronic component, manufacturing method thereof and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 13, 2015·5 cites·14 claims
- 2582US11935701B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Mar 19, 2024·0 cites·14 claims
- 2682US10163568B2Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereonSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 25, 2018·2 cites·11 claims
- 2781US11842853B2Multilayered electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 12, 2023·1 cites·14 claims
- 2881US9168468B2System and method for recycling high-boiling-point waste photoresist stripperKOREX CORP·Filed 2015·Granted Oct 27, 2015·3 cites·12 claims
- 2981US8941971B2Multilayer ceramic electronic component and fabrication method thereofPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·4 cites·9 claims
- 3080US9165712B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Oct 20, 2015·4 cites·3 claims
- 3179US12172234B2Laser welding method and monitoring method for secondary batterySAMSUNG SDI CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 3279US10818436B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 27, 2020·1 cites·9 claims
- 3379US9743514B2Multilayer ceramic electronic component, method of manufacturing the same, and circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 22, 2017·3 cites·41 claims
- 3478US10804034B2Capacitor component having secondary phase material contained in external electrode thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 13, 2020·1 cites·19 claims
- 3578US10790087B2Multilayer ceramic electronic part having external electrode including conductive resin layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 29, 2020·1 cites·23 claims
- 3678US8961744B2System and method for recycling high-boiling-point waste photoresist stripperKOREX CORP·Filed 2014·Granted Feb 24, 2015·3 cites·9 claims
- 3778US2025226156A1Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 3875US11901130B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 3975US8675343B2Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereofPARK MYUNG JUN·Filed 2012·Granted Mar 18, 2014·2 cites·19 claims
- 4074US9324496B2Multilayer ceramic electronic component and method of manufacturing the sameLEE JONG HO·Filed 2012·Granted Apr 26, 2016·2 cites·7 claims
- 4174US8767375B2Multilayer ceramic electronic component and method of fabricating the samePARK MYUNG JUN·Filed 2012·Granted Jul 1, 2014·2 cites·14 claims
- 4272US11699554B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 4372US11646161B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 9, 2023·0 cites·14 claims
- 4472US10312022B2Capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 4, 2019·1 cites·13 claims
- 4571US11657978B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 23, 2023·0 cites·18 claims
- 4670US9305705B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·1 cites·32 claims
- 4769US11152155B2Capacitor component having secondary phase material contained in external electrode thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Oct 19, 2021·0 cites·22 claims
- 4869US9793052B2Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereonSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 17, 2017·1 cites·11 claims
- 4968US12288647B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 29, 2025·0 cites·18 claims
- 5068US11605484B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 14, 2023·0 cites·19 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →