Inventor · disambiguated record
Myong Hwan Park
Also filed as: PARK MYONG HWAN
2 granted patents·1 pending application·1 citations·filing 2021–2023
31Inventor score
Files withYMT CO LTD3
Top patents by PatentIndex Score
3 records- 0173US12495494B2Metal foil, carrier with metal foil comprising the same and printed circuit board including the sameYMT CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·7 claims
- 0257US2025031316A1Methods for forming circuit pattern on substrate using metal foil with low surface roughnessYMT CO LTD·Filed 2023·Application pending·0 cites
- 0355US12408279B2Release layer for metal foil with carrier and metal foil comprising the sameYMT CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →