Inventor · disambiguated record
Nai-Shung Chang
Also filed as: CHANG NAI-SHUNG
87 granted patents·9 pending applications·1,305 citations·filing 1998–2024
99Inventor score
Files withVIA TECH INC80SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD5CHANG NAI-SHUNG3VIA ALLIANCE SEMICONDUCTOR CO LTD2VIA TECHNOLOGYIES INC1
Top patents by PatentIndex Score
96 records- 0198US6745275B2Feedback system for accomodating different memory module loadingVIA TECH INC·Filed 2001·Granted Jun 1, 2004·174 cites·4 claims
- 0296US7007175B2Motherboard with reduced power consumptionVIA TECH INC·Filed 2001·Granted Feb 28, 2006·160 cites·15 claims
- 0392US6502172B2Memory accessing and controlling unitVIA TECH INC·Filed 2002·Granted Dec 31, 2002·65 cites·8 claims
- 0490US7003684B2Memory control chip, control method and control circuitVIA TECH INC·Filed 2002·Granted Feb 21, 2006·53 cites·19 claims
- 0590US6738880B2Buffer for varying data access speed and system applying the sameVIA TECH INC·Filed 2001·Granted May 18, 2004·61 cites·33 claims
- 0687US7783905B2Method for reducing power consumption of a computer system in the working stateVIA TECH INC·Filed 2006·Granted Aug 24, 2010·16 cites·7 claims
- 0787US6590827B2Clock device for supporting multiplicity of memory module typesVIA TECH INC·Filed 2001·Granted Jul 8, 2003·55 cites·21 claims
- 0885US8335941B2Method for reducing power consumption of a computer system in the working stateCHANG NAI-SHUNG·Filed 2010·Granted Dec 18, 2012·9 cites·18 claims
- 0985US6072334ASignal converter with a dynamically adjustable reference voltage and chipset including the sameVIA TECH INC·Filed 1998·Granted Jun 6, 2000·48 cites·31 claims
- 1083US7689847B2Method for increasing the data processing capability of a computer systemVIA TECH INC·Filed 2006·Granted Mar 30, 2010·13 cites·25 claims
- 1183US6836848B2Power management integrated circuit for overriding an internal frequency ID code of a processor and for providing frequency ID value to a bridge chipsetVIA TECH INC·Filed 2001·Granted Dec 28, 2004·39 cites·14 claims
- 1280US7298028B2Printed circuit board for thermal dissipation and electronic device using the sameVIA TECH INC·Filed 2005·Granted Nov 20, 2007·8 cites·18 claims
- 1379US10568199B2Printed circuit board and semiconductor package structureSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 18, 2020·2 cites·23 claims
- 1476US6842347B2Data processing system and associated control chip and printed circuit boardVIA TECH INC·Filed 2002·Granted Jan 11, 2005·17 cites·9 claims
- 1576US6820219B1Integrated testing method for concurrent testing of a number of computer components through software simulationVIA TECH INC·Filed 2000·Granted Nov 16, 2004·22 cites·19 claims
- 1675US6424555B1Mother board and computer system capable of flexibly using synchronous dynamic random access memory and double data rate dynamic random access memoryVIA TECH INC·Filed 2000·Granted Jul 23, 2002·19 cites·24 claims
- 1772US6384346B1Trace layout of a printed circuit board with AGP and PCI slotsVIA TECH INC·Filed 2000·Granted May 7, 2002·19 cites·14 claims
- 1872US6362996B2Terminating circuit module used in a computer systemVIA TECH INC·Filed 2001·Granted Mar 26, 2002·16 cites·15 claims
- 1971US6498759B2System for automatic generation of suitable voltage source on motherboardVIA TECH INC·Filed 2000·Granted Dec 24, 2002·17 cites·21 claims
- 2070US6528872B2Packaging structure for ball grid arrayVIA TECH INC·Filed 2002·Granted Mar 4, 2003·12 cites·15 claims
- 2168US6218817B1Voltage-switching regulator with built-in voltage-switching module for a memory moduleVIA TECH INC·Filed 2000·Granted Apr 17, 2001·16 cites·15 claims
- 2266US7095415B2Graphics display architecture and control chip set thereofVIA TECH INC·Filed 2004·Granted Aug 22, 2006·11 cites·19 claims
- 2364US7525182B2Multi-package module and electronic device using the sameVIA TECH INC·Filed 2005·Granted Apr 28, 2009·2 cites·8 claims
- 2464US6944783B2Power controller and associated multi-processor type supporting computer systemVIA TECH INC·Filed 2001·Granted Sep 13, 2005·10 cites·10 claims
- 2563US7030502B2BGA package with same power ballout assignment for wire bonding packaging and flip chip packagingVIA TECH INC·Filed 2003·Granted Apr 18, 2006·11 cites·12 claims
- 2662US6756665B1Integrated circuit package structure with heat dissipating designVIA TECH INC·Filed 2003·Granted Jun 29, 2004·10 cites·20 claims
- 2762US6404610B1Device for detecting and method for conditioning temperature inside notebook computerVIA TECH INC·Filed 2000·Granted Jun 11, 2002·7 cites·6 claims
- 2862US6370053B2Memory address driver circuitVIA TECH INC·Filed 2001·Granted Apr 9, 2002·9 cites·9 claims
- 2961US6309099B1Device for detecting temperature inside a notebook computerVIA TECH INC·Filed 1999·Granted Oct 30, 2001·31 cites·14 claims
- 3060US2025106996A1Electronic assemblyVIA TECH INC·Filed 2024·Application pending·0 cites
- 3159US11362464B2Contact arrangement, circuit board, and electronic assemblySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·19 claims
- 3259US11316305B2Contact arrangement, circuit board, and electronic assemblySHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 3359US7047430B2Method for saving chipset power consumptionVIA TECH INC·Filed 2001·Granted May 16, 2006·6 cites·10 claims
- 3458US10568200B2Printed circuit board and semiconductor package structureSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·17 claims
- 3558US10568198B2Printed circuit board and semiconductor package structureSHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·19 claims
- 3658US6583365B2Conductive pads layout for BGA packaging structureVIA TECH INC·Filed 2002·Granted Jun 24, 2003·6 cites·17 claims
- 3758US6259371B1Power surge detection deviceVIA TECH INC·Filed 1998·Granted Jul 10, 2001·32 cites·43 claims
- 3857US6681286B2Control chipset having dual-definition pins for reducing circuit layout of memory slotVIA TECH INC·Filed 2001·Granted Jan 20, 2004·10 cites·14 claims
- 3956US12191242B2Contact arrangement and electronic assemblyVIA TECH INC·Filed 2022·Granted Jan 7, 2025·0 cites·30 claims
- 4056US6928540B2Method and system for synchronizing a clock frequency multiplier with a CPU using a serial initialization packet protocolVIA TECH INC·Filed 2001·Granted Aug 9, 2005·4 cites·14 claims
- 4156US6542996B1Method of implementing energy-saving suspend-to-RAM modeVIA TECH INC·Filed 1999·Granted Apr 1, 2003·36 cites·22 claims
- 4255US7054984B2Structure and method for extended bus and bridge in the extended busVIA TECH INC·Filed 2001·Granted May 30, 2006·3 cites·6 claims
- 4355US6946731B2Layout structure for providing stable power source to a main bridge chip substrate and a motherboardVIA TECH INC·Filed 2002·Granted Sep 20, 2005·5 cites·11 claims
- 4454US7723843B2Multi-package module and electronic device using the sameVIA TECH INC·Filed 2009·Granted May 25, 2010·0 cites·6 claims
- 4554US6844620B2Power layout structure of main bridge chip substrate and motherboardVIA TECH INC·Filed 2002·Granted Jan 18, 2005·4 cites·25 claims
- 4653US6877102B2Chipset supporting multiple CPU's and layout method thereofVIA TECH INC·Filed 2001·Granted Apr 5, 2005·3 cites·16 claims
- 4753US6484281B1Software-based simulation system capable of simulating the combined functionality of a north bridge test module and a south bridge test moduleVIA TECH INC·Filed 1999·Granted Nov 19, 2002·17 cites·14 claims
- 4853US6229335B1Input/output buffer capable of supporting a multiple of transmission logic busesVIA TECH INC·Filed 1999·Granted May 8, 2001·10 cites·10 claims
- 4953US6148398ASetting/driving circuit for use with an integrated circuit logic unit having multi-function pinsVIA TECH INC·Filed 1999·Granted Nov 14, 2000·32 cites·9 claims
- 5052US6564300B2Method and system for controlling the memory access operation by central processing unit in a computer systemVIA TECH INC·Filed 2001·Granted May 13, 2003·2 cites·14 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →