Inventor · disambiguated record
Nan-Jang Chen
Also filed as: CHEN NAN · CHEN NAN-JANG
41 granted patents·7 pending applications·105 citations·filing 2001–2024
96Inventor score
Files withMEDIATEK INC24CHEN NAN-JANG12ABB SCHWEIZ AG4LUMILEDS LLC3BEIJING KINGSOFT CLOUD NETWORK TECHNIQUE CO LTD1
Top patents by PatentIndex Score
48 records- 0189US8018037B2Semiconductor chip packageMEDIATEK INC·Filed 2009·Granted Sep 13, 2011·15 cites·22 claims
- 0285US8058720B2Semiconductor packageCHEN NAN-JANG·Filed 2008·Granted Nov 15, 2011·14 cites·17 claims
- 0384US9949360B2Printed circuit board design for high speed applicationCHEN NAN JANG·Filed 2012·Granted Apr 17, 2018·6 cites·19 claims
- 0483US8213206B2Electronic apparatusCHEN NAN-JANG·Filed 2010·Granted Jul 3, 2012·6 cites·20 claims
- 0582US7834436B2Semiconductor chip packageMEDIATEK INC·Filed 2008·Granted Nov 16, 2010·8 cites·12 claims
- 0681US10019048B2Early power compensation method and apparatus thereofMEDIATEK INC·Filed 2016·Granted Jul 10, 2018·3 cites·19 claims
- 0778US11903121B2Printed circuit board design for high speed applicationMEDIATEK INC·Filed 2022·Granted Feb 13, 2024·0 cites·13 claims
- 0878US8120927B2Printed circuit boardCHEN NAN-JANG·Filed 2008·Granted Feb 21, 2012·6 cites·20 claims
- 0977US9269653B2SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG patternMEDIATEK INC·Filed 2013·Granted Feb 23, 2016·4 cites·8 claims
- 1077US7834435B2Leadframe with extended pad segments between leads and die pad, and leadframe package using the sameMEDIATEK INC·Filed 2008·Granted Nov 16, 2010·7 cites·19 claims
- 1176US8212343B2Semiconductor chip packageCHEN NAN-JANG·Filed 2010·Granted Jul 3, 2012·3 cites·15 claims
- 1275US7932586B2Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereofMEDIATEK INC·Filed 2007·Granted Apr 26, 2011·6 cites·9 claims
- 1374US9955581B2SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG patternMEDIATEK INC·Filed 2016·Granted Apr 24, 2018·2 cites·28 claims
- 1470US2020352023A1Printed circuit board design for high speed applicationMEDIATEK INC·Filed 2020·Application pending·0 cites
- 1569US8350380B2Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package productMEDIATEK INC·Filed 2012·Granted Jan 8, 2013·2 cites·12 claims
- 1668US11437927B2Voltage source converter generating a pulse train using two voltage levelsHITACHI ENERGY SWITZERLAND AG·Filed 2018·Granted Sep 6, 2022·2 cites·20 claims
- 1767US9445492B2Printed circuit boardCHEN NAN-JANG·Filed 2012·Granted Sep 13, 2016·1 cites·4 claims
- 1866US8525310B2Leadframe package for high-speed data rate applicationsCHEN NAN-JANG·Filed 2011·Granted Sep 3, 2013·2 cites·11 claims
- 1965US10772191B2Printed circuit board design for high speed applicationMEDIATEK INC·Filed 2019·Granted Sep 8, 2020·0 cites·9 claims
- 2065US10284076B2Converter module for HVDC power stationABB SCHWEIZ AG·Filed 2016·Granted May 7, 2019·2 cites·20 claims
- 2165US8283757B2Quad flat package with exposed common electrode barsCHEN NAN-CHENG·Filed 2010·Granted Oct 9, 2012·2 cites·21 claims
- 2264US2025105111A1Semiconductor deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2363US7875965B2Semiconductor chip packageMEDIATEK INC·Filed 2008·Granted Jan 25, 2011·2 cites·25 claims
- 2463US6703691B2Quad flat non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 9, 2004·11 cites·12 claims
- 2561US10485095B2Printed circuit board design for high speed applicationMEDIATEK INC·Filed 2018·Granted Nov 19, 2019·0 cites·5 claims
- 2659US8124461B2Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package productCHEN NAN-JANG·Filed 2007·Granted Feb 28, 2012·1 cites·12 claims
- 2756US9406595B2Semiconductor packageMEDIATEK INC·Filed 2014·Granted Aug 2, 2016·0 cites·13 claims
- 2856US2023384215A1Multilayer environment scanningDEEPX DIAGNOSTICS INC·Filed 2023·Application pending·0 cites
- 2955US11511467B2Light emitting device and manufacturing method thereofLUMILEDS LLC·Filed 2018·Granted Nov 29, 2022·0 cites·16 claims
- 3053US8941221B2Semiconductor packageMEDIATEK INC·Filed 2012·Granted Jan 27, 2015·0 cites·17 claims
- 3152US9681554B2Printed circuit boardCHEN NAN-JANG·Filed 2008·Granted Jun 13, 2017·0 cites·10 claims
- 3250US10163767B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 3350US8288848B2Semiconductor chip package including a lead frameCHEN NAN-JANG·Filed 2011·Granted Oct 16, 2012·0 cites·20 claims
- 3450US8106490B2Semiconductor chip packageCHEN NAN-JANG·Filed 2010·Granted Jan 31, 2012·0 cites·11 claims
- 3547US9147664B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Sep 29, 2015·0 cites·14 claims
- 3646US11158772B2Lighting assembly and method for manufacturing a lighting assemblyLUMILEDS LLC·Filed 2017·Granted Oct 26, 2021·0 cites·5 claims
- 3746US10211134B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Feb 19, 2019·0 cites·23 claims
- 3846US9852966B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Dec 26, 2017·0 cites·17 claims
- 3946US9806053B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Oct 31, 2017·0 cites·20 claims
- 4045US10181726B2Power transfer between phases in a transformerABB SCHWEIZ AG·Filed 2015·Granted Jan 15, 2019·0 cites·19 claims
- 4145US2009020859A1Quad flat package with exposed common electrode barsMEDIATEK INC·Filed 2008·Application pending·0 cites
- 4245US2012018862A1Semiconductor packageCHEN NAN-JANG·Filed 2011·Application pending·0 cites
- 4344US11784581B2ConverterABB SCHWEIZ AG·Filed 2021·Granted Oct 10, 2023·0 cites·10 claims
- 4442US9392696B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Jul 12, 2016·0 cites·23 claims
- 4541US10426035B2SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG patternMEDIATEK INC·Filed 2018·Granted Sep 24, 2019·0 cites·35 claims
- 4639US2022300928A1Cloud Computing Metering and Charging Method and Apparatus, and Electronic Device and Storage MediumBEIJING KINGSOFT CLOUD NETWORK TECHNIQUE CO LTD·Filed 2020·Application pending·0 cites
- 4737US2019371989A1Method of manufacturing a lead frameLUMILEDS LLC·Filed 2017·Application pending·0 cites
- 4834US10886914B2Semiconductor switch with magnetic coupling deviceABB SCHWEIZ AG·Filed 2017·Granted Jan 5, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →