Inventor · disambiguated record
Nabankur Deb
Also filed as: DEB NABANKUR
0 granted patents·3 pending applications·0 citations·filing 2022–2024
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0152US2025309143A1Hermetic layer above a die and mold material within a packageINTEL CORP·Filed 2024·Application pending·0 cites
- 0251US2024413031A1On die flexure control device and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0350US2023317546A1Die backside film with overhang for die sidewall protectionINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →