Inventor · disambiguated record
Nadine Engelhardt
Also filed as: ENGELHARDT NADINE
6 granted patents·10 pending applications·0 citations·filing 2018–2023
64Inventor score
Files withBASF SE16
Top patents by PatentIndex Score
16 records- 0171US2022298664A1Composition for Cobalt Electroplating Comprising Leveling AgentBASF SE·Filed 2022·Application pending·0 cites
- 0266US11377748B2Composition for cobalt electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 5, 2022·0 cites·12 claims
- 0363US11840771B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 0461US2025388725A1Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodepositionBASF SE·Filed 2023·Application pending·0 cites
- 0555US2025051949A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2022·Application pending·0 cites
- 0653US11459665B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2018·Granted Oct 4, 2022·0 cites·19 claims
- 0753US11242606B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 0850US12098473B2Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2019·Granted Sep 24, 2024·0 cites·19 claims
- 0950US2023203694A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2021·Application pending·0 cites
- 1049US2022356592A1Composition for copper bump electrodeposition comprising a leveling agentBASF SE·Filed 2020·Application pending·0 cites
- 1148US2022177808A1Cationic surfactant and its use in laundry detergent compositionsBASF SE·Filed 2020·Application pending·0 cites
- 1247US2025051950A1Alkaline composition for copper electroplating comprising a defect reduction agentBASF SE·Filed 2022·Application pending·0 cites
- 1346US2025129503A1Composition for copper electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2022·Application pending·0 cites
- 1445US12134834B2Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 1543US2023203695A1Alkaline Composition For Copper Electroplating Comprising A Defect Reduction AgentBASF SE·Filed 2021·Application pending·0 cites
- 1641US2023265576A1Composition For Copper Electroplating On A Cobalt SeedBASF SE·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →