Inventor · disambiguated record
Naohiko Hirano
Also filed as: HIRANO NAOHIKO
29 granted patents·3 pending applications·1,335 citations·filing 1992–2015
98Inventor score
Top patents by PatentIndex Score
32 records- 0195US5633479AMultilayer wiring structure for attaining high-speed signal propagationTOSHIBA KK·Filed 1995·Granted May 27, 1997·201 cites·15 claims
- 0294US5629566AFlip-chip semiconductor devices having two encapsulantsTOSHIBA KK·Filed 1995·Granted May 13, 1997·199 cites·18 claims
- 0393US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0492US9269576B2Silicon carbide semiconductor substrate and method for manufacturing sameDENSO CORP·Filed 2013·Granted Feb 23, 2016·24 cites·6 claims
- 0591US7793820B2Solder preform and a process for its manufactureSENJU METAL INDUSTRY CO·Filed 2008·Granted Sep 14, 2010·31 cites·19 claims
- 0690US5648686AConnecting electrode portion in semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 15, 1997·115 cites·22 claims
- 0789US7019395B2Double-sided cooling type semiconductor moduleDENSO CORP·Filed 2004·Granted Mar 28, 2006·53 cites·13 claims
- 0889US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0985US7145254B2Transfer-molded power device and method for manufacturing transfer-molded power deviceDENSO CORP·Filed 2002·Granted Dec 5, 2006·45 cites·3 claims
- 1085US6384431B1Insulated gate bipolar transistorDENSO CORP·Filed 2000·Granted May 7, 2002·40 cites·5 claims
- 1184US7800230B2Solder preform and electronic componentDENSO CORP·Filed 2007·Granted Sep 21, 2010·12 cites·4 claims
- 1282US6917103B2Molded semiconductor power device having heat sinks exposed on one surfaceDENSO CORP·Filed 2002·Granted Jul 12, 2005·33 cites·19 claims
- 1382US5309024AMultilayer packageTOSHIBA KK·Filed 1992·Granted May 3, 1994·71 cites·21 claims
- 1478US7235876B2Semiconductor device having metallic plate with grooveDENSO CORP·Filed 2006·Granted Jun 26, 2007·8 cites·8 claims
- 1575US10081852B2Solder preform and a process for its manufactureHIRANO NAOHIKO·Filed 2010·Granted Sep 25, 2018·2 cites·14 claims
- 1674US6927167B2Method for manufacturing semiconductor device having controlled surface roughnessDENSO CORP·Filed 2003·Granted Aug 9, 2005·21 cites·14 claims
- 1774US6803667B2Semiconductor device having a protective filmDENSO CORP·Filed 2002·Granted Oct 12, 2004·22 cites·38 claims
- 1874US5401688ASemiconductor device of multichip module-typeTOSHIBA KK·Filed 1993·Granted Mar 28, 1995·55 cites·7 claims
- 1965US6884953B2Switching circuitDENSO CORP·Filed 2002·Granted Apr 26, 2005·13 cites·9 claims
- 2063US5567983ASemiconductor apparatus capable of cooling a semiconductor element with radiation efficiencyTOSHIBA KK·Filed 1995·Granted Oct 22, 1996·25 cites·2 claims
- 2160US7239016B2Semiconductor device having heat radiation plate and bonding memberDENSO CORP·Filed 2004·Granted Jul 3, 2007·9 cites·24 claims
- 2258US5530289ASemiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1994·Granted Jun 25, 1996·25 cites·10 claims
- 2357US5814891AFlip-chip connecting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 29, 1998·22 cites·23 claims
- 2457US5645123ASemiconductor device having temperature regulation means formed in circuit boardTOSHIBA KK·Filed 1994·Granted Jul 8, 1997·24 cites·8 claims
- 2555US5548161ASemiconductor apparatus capable of cooling a semiconductor element with low radiation efficiencyTOSHIBA KK·Filed 1995·Granted Aug 20, 1996·18 cites·2 claims
- 2650US7193326B2Mold type semiconductor deviceDENSO CORP·Filed 2004·Granted Mar 20, 2007·3 cites·23 claims
- 2749US7468318B2Method for manufacturing mold type semiconductor deviceDENSO CORP·Filed 2007·Granted Dec 23, 2008·0 cites·5 claims
- 2841US7345369B2Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Mar 18, 2008·0 cites·6 claims
- 2940US2005167802A1Semiconductor deviceDENSO CORP·Filed 2004·Application pending·0 cites
- 3039US2005121701A1Semiconductor deviceDENSO CORP·Filed 2004·Application pending·0 cites
- 3139US2005170555A1Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chipDENSO CORP·Filed 2005·Application pending·0 cites
- 3234US10002841B2Semiconductor deviceDENSO CORP·Filed 2015·Granted Jun 19, 2018·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →