Inventor · disambiguated record
Naoto Hosotani
Also filed as: HOSOTANI NAOTO
19 granted patents·2 pending applications·180 citations·filing 1998–2021
94Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD10TORAY INDUSTRIES5PANASONIC CORP2ASAIDA YASUHIRO1PANASONIC HOLDINGS CORP1
Top patents by PatentIndex Score
21 records- 0184US6544377B1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 8, 2003·40 cites·13 claims
- 0282US6839959B1Component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 11, 2005·29 cites·52 claims
- 0380US7357288B2Component connecting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 15, 2008·26 cites·12 claims
- 0479US9548477B2Battery blockASAIDA YASUHIRO·Filed 2012·Granted Jan 17, 2017·4 cites·12 claims
- 0573US7490652B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2005·Granted Feb 17, 2009·5 cites·6 claims
- 0672US8835032B2Battery moduleTAKASAKI HIROSHI·Filed 2011·Granted Sep 16, 2014·2 cites·5 claims
- 0771US7938929B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2009·Granted May 10, 2011·4 cites·8 claims
- 0870US6506222B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 14, 2003·11 cites·13 claims
- 0961US12060659B2Method of producing flame-resistant fiber bundle and carbon fiber bundle and flameproofing furnaceTORAY INDUSTRIES·Filed 2019·Granted Aug 13, 2024·0 cites·10 claims
- 1060US6561408B2Bonding head and component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted May 13, 2003·9 cites·20 claims
- 1159US12358268B2Laminating devicePANASONIC HOLDINGS CORP·Filed 2021·Granted Jul 15, 2025·0 cites·6 claims
- 1259US6246789B1Component mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 12, 2001·31 cites·28 claims
- 1357US12359349B2Method for manufacturing carbon fiber bundleTORAY INDUSTRIES·Filed 2021·Granted Jul 15, 2025·0 cites·3 claims
- 1456US12012671B2Method for producing flame-proof fiber bundle, and method for producing carbon fiber bundleTORAY INDUSTRIES·Filed 2019·Granted Jun 18, 2024·0 cites·7 claims
- 1556US2023119738A1Oxidized fiber bundles, carbon fiber bundle production method, and oxidation furnaceTORAY INDUSTRIES·Filed 2021·Application pending·0 cites
- 1654US7076867B2Pressurizing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 18, 2006·5 cites·16 claims
- 1754US6995342B2Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 7, 2006·5 cites·3 claims
- 1849US12031244B2Oxidation heat treatment oven and method for manufacturing oxidized fiber bundle and carbon fiber bundleTORAY INDUSTRIES·Filed 2020·Granted Jul 9, 2024·0 cites·11 claims
- 1946US6797926B2Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 28, 2004·2 cites·26 claims
- 2041US6264704B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 24, 2001·7 cites·14 claims
- 2140US2003121616A1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →