Inventor · disambiguated record
Nai-Jen Hsuan
Also filed as: HSUAN NAI-JEN
2 granted patents·3 pending applications·1 citations·filing 2021–2025
30Inventor score
Technology areasH10W
Files withREALTEK SEMICONDUCTOR CORP5
Top patents by PatentIndex Score
5 records- 0176US11621221B2Ball grid array package and package substrate thereofREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 0252US12062598B2Integrated circuit lead frame and semiconductor device thereofREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0349US2025069995A1Semiconductor device and manufacturing method thereofREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0447US2025029902A1Lead frame and manufacturing method of semiconductor deviceREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0545US2025379114A1Package structureREALTEK SEMICONDUCTOR CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →