Inventor · disambiguated record

Nackyong Joo

Also filed as: Joo Nackyong

16 granted patents·9 pending applications·2 citations·filing 2016–2024

84Inventor score

Technology areasH10P H10D H01L H10W

Files withHYUNDAI MOTOR CO LTD25

Top patents by PatentIndex Score

25 records

0174US10164020B2Semiconductor device and method manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·18 claims
0262US12262546B2Semiconductor device and three-phase inverter comprising the sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·13 claims
0359US12342570B2Method for manufacturing semiconductor device and semiconductor device manufactured therebyHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·15 claims
0459US2025194124A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
0558US2024395923A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
0658US2025022917A1Semiconductor device and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
0757US11990527B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2021·Granted May 21, 2024·0 cites·15 claims
0857US2025006843A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
0956US12230697B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·26 claims
1056US11837636B2Semiconductor module and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
1156US2025022950A1Semiconductor device and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
1255US12027517B2Semiconductor module and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
1349US12224341B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·15 claims
1447US11056596B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Jul 6, 2021·0 cites·9 claims
1546US10121863B2Semiconductor device and method manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2017·Granted Nov 6, 2018·0 cites·17 claims
1645US2022285485A1Schottky barrier diode and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2021·Application pending·0 cites
1744US10797170B2Semiconductor device and manufacturing method thereofHYUNDAI MOTOR CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·19 claims
1844US10586877B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·11 claims
1943US10319851B2Semiconductor device and method for manufacturing sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
2043US9997624B2Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·17 claims
2141US2019341504A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2018·Application pending·0 cites
2240US10249732B1Manufacturing method of semiconductor device to uniformly form thickness of gate insulating layerHYUNDAI MOTOR CO LTD·Filed 2017·Granted Apr 2, 2019·0 cites·10 claims
2338US10115816B2Semiconductor device and manufacturing method thereofHYUNDAI MOTOR CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·7 claims
2436US2018122911A1Semiconductor device and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2016·Application pending·0 cites
2535US2017170310A1Semiconductor device and manufacturing method of the semiconductor deviceHYUNDAI MOTOR CO LTD·Filed 2016·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Nackyong Joo files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →