Inventor · disambiguated record
Nafees Kabir
Also filed as: KABIR NAFEES · KABIR NAFEES A · KABIR NAFEES AMINUL
25 granted patents·8 pending applications·28 citations·filing 2018–2025
92Inventor score
Top patents by PatentIndex Score
33 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0298US11239156B2Planar slab vias for integrated circuit interconnectsINTEL CORP·Filed 2020·Granted Feb 1, 2022·5 cites·15 claims
- 0395US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0494US11342227B2Stacked transistor structures with asymmetrical terminal interconnectsINTEL CORP·Filed 2020·Granted May 24, 2022·3 cites·20 claims
- 0583US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 0683US10665499B2Integrated circuit with airgaps to control capacitanceINTEL CORP·Filed 2018·Granted May 26, 2020·4 cites·23 claims
- 0780US11289421B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0880US2025372524A1Integrated circuit structure with filled recessesSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2025·Application pending·0 cites
- 0974US11462469B2Single mask lithography line end enhancementINTEL CORP·Filed 2018·Granted Oct 4, 2022·2 cites·28 claims
- 1072US12087836B2Contact over active gate structures with metal oxide-caped contacts to inhibit shortingINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1170US12341092B2Planar slab vias for integrated circuit interconnectsINTEL CORP·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1270US11784123B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1366US12266527B1Directed self-assembly enabled patterning over metal layers using assisting featuresINTEL CORP·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 1465US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 1564US12484247B2Gate-all-around integrated circuit structures having backside contact with enhanced area relative to epitaxial sourceINTEL CORP·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1664US2025174458A1Directed self-assembly enabled patterning over metal layers using assisting featuresINTEL CORP·Filed 2025·Application pending·0 cites
- 1758US12266729B2Angled etch to enable tin removal from selected sidewallsINTEL CORP·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 1857US2025218942A1Via aligned with adjacent interconnect layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1955US12293913B1Directed self-assembly enabled subtractive metal patterningINTEL CORP·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 2055US11837644B2Contact over active gate structures with metal oxide-caped contacts to inhibit shortingINTEL CORP·Filed 2019·Granted Dec 5, 2023·0 cites·19 claims
- 2155US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 2254US12412838B2Integrated circuit structure with filled recessesINTEL CORP·Filed 2019·Granted Sep 9, 2025·0 cites·20 claims
- 2354US2024203868A1Serial directed self-assembly (dsa) processes for forming metal layer with cutINTEL CORP·Filed 2022·Application pending·0 cites
- 2454US2024114693A1Self-aligned patterning of plate lines in three-dimensional ferroelectric capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2553US12261114B2Metallization stacks with self-aligned staggered metal linesINTEL CORP·Filed 2020·Granted Mar 25, 2025·0 cites·22 claims
- 2653US2024105588A1Integrated circuit (ic) device with multilayer metal lineINTEL CORP·Filed 2022·Application pending·0 cites
- 2750US11646266B2Helmet structures for semiconductor interconnectsINTEL CORP·Filed 2019·Granted May 9, 2023·0 cites·23 claims
- 2850US2023187395A1Oxide and carbon layers at a surface of a substrate for hybrid bondingINTEL CORP·Filed 2021·Application pending·0 cites
- 2949US11594673B2Two terminal spin orbit memory devices and methods of fabricationINTEL CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 3048US11610810B2Maskless air gap enabled by a single damascene processINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·9 claims
- 3148US11404482B2Self-aligned repeatedly stackable 3D vertical RRAMINTEL CORP·Filed 2018·Granted Aug 2, 2022·0 cites·9 claims
- 3247US11424160B2Self-aligned local interconnectsINTEL CORP·Filed 2019·Granted Aug 23, 2022·0 cites·25 claims
- 3347US2023097736A1Ferroelectric random access memory (fram) devices with enhanced capacitor architectureINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →