Inventor · disambiguated record
Navas Khan Oratti Kalandar
Also filed as: KALANDAR NAVAS KHAN ORATTI
23 granted patents·11 pending applications·139 citations·filing 2008–2017
93Inventor score
Files withKALANDAR NAVAS KHAN ORATTI8MUNIANDY KESVAKUMAR V C8FOONG CHEE SENG3LOW BOON YEW3KUMAR SHAILESH2
Top patents by PatentIndex Score
34 records- 0196US8669140B1Method of forming stacked die package using redistributed chip packagingMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Mar 11, 2014·51 cites·20 claims
- 0295US9064718B1Pre-formed via array for integrated circuit packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Jun 23, 2015·37 cites·18 claims
- 0392US8772913B1Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Jul 8, 2014·14 cites·9 claims
- 0487US9034694B1Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2014·Granted May 19, 2015·9 cites·12 claims
- 0582US9721928B1Integrated circuit package having two substratesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 1, 2017·4 cites·15 claims
- 0679US9209147B1Method of forming pillar bumpFOONG CHEE SENG·Filed 2014·Granted Dec 8, 2015·6 cites·13 claims
- 0772US8836098B1Surface mount semiconductor device with solder ball reinforcement frameSUKEMI NORAZHAM MOHD·Filed 2013·Granted Sep 16, 2014·6 cites·13 claims
- 0871US8945989B2Stiffened semiconductor die packageMUNIANDY KESVAKUMAR V C·Filed 2014·Granted Feb 3, 2015·2 cites·11 claims
- 0967US9196598B1Semiconductor device having power distribution using bond wiresKUMAR SHAILESH·Filed 2014·Granted Nov 24, 2015·2 cites·6 claims
- 1062US8698288B1Flexible substrate with crimping interconnectionLOW BOON YEW·Filed 2013·Granted Apr 15, 2014·2 cites·16 claims
- 1161US9997445B2Substrate interconnections for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Jun 12, 2018·1 cites·8 claims
- 1259US9476788B2Semiconductor sensor with gel filled cavityKALANDAR NAVAS KHAN ORATTI·Filed 2014·Granted Oct 25, 2016·3 cites·19 claims
- 1356US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 1450US10211184B2Apparatus and methods for multi-die packagingNXP USA INC·Filed 2017·Granted Feb 19, 2019·0 cites·20 claims
- 1547US9299675B2Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2015·Granted Mar 29, 2016·0 cites·7 claims
- 1646US9401345B2Semiconductor device package with organic interposerFOONG CHEE SENG·Filed 2014·Granted Jul 26, 2016·0 cites·14 claims
- 1745US2016163671A1Integrated circuit package with power platesKUMAR SHAILESH·Filed 2014·Application pending·0 cites
- 1844US8643189B1Packaged semiconductor die with power rail padsLOW BOON YEW·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 1943US9159682B2Copper pillar bump and flip chip package using sameFOONG CHEE SENG·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 2043US2016056094A1Ball grid array package with more signal routing structuresMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
- 2143US2015221592A1Semiconductor device with package-level decoupling capacitors formed with bond wiresVERMA CHETAN·Filed 2014·Application pending·0 cites
- 2242US8466550B2Semiconductor structure and a method of manufacturing a semiconductor structureKALANDAR NAVAS KHAN ORATTI·Filed 2008·Granted Jun 18, 2013·0 cites·13 claims
- 2342US2015187728A1Emiconductor device with die top power connectionsMUNIANDY KESVAKUMAR V C·Filed 2013·Application pending·0 cites
- 2442US2014374891A1Semiconductor device with heat spreader and thermal sheetLOW BOON YEW·Filed 2013·Application pending·0 cites
- 2542US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 2641US9190355B2Multi-use substrate for integrated circuitCHAN WENG HOONG·Filed 2014·Granted Nov 17, 2015·0 cites·18 claims
- 2741US2016086880A1Copper wire through silicon via connectionKALANDAR NAVAS KHAN ORATTI·Filed 2014·Application pending·0 cites
- 2841US2015115420A1Sensor die grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2013·Application pending·0 cites
- 2940US8853058B2Method of making surface mount stacked semiconductor devicesMUNIANDY KESVAKUMAR V C·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
- 3040US2014231977A1Semiconductor packages with low stand-off interconnections between chipsKALANDAR NAVAS KHAN ORATTI·Filed 2013·Application pending·0 cites
- 3140US2015206769A1Lead frame based semiconductor device with power barsMUNIANDY KESVAKUMAR V C·Filed 2014·Application pending·0 cites
- 3238US8810020B2Semiconductor device with redistributed contactsKALANDAR NAVAS KHAN ORATTI·Filed 2012·Granted Aug 19, 2014·0 cites·7 claims
- 3336US8987881B2Hybrid lead frame and ball grid array packageTENG SENG KIONG·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 3430US2014263584A1Wire bonding apparatus and methodYAP JIA LIN·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →