Inventor · disambiguated record
Naoki Kanagawa
Also filed as: KANAGAWA NAOKI
7 granted patents·44 citations·filing 2000–2019
80Inventor score
Top patents by PatentIndex Score
7 records- 0187US10703939B2Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 7, 2020·6 cites·15 claims
- 0286US6469074B1Composition of cyanate ester, epoxy resin and acid anhydrideMATSUSHITA ELECTRIC WORKS LTD·Filed 2000·Granted Oct 22, 2002·29 cites·16 claims
- 0366US10870756B2Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·25 claims
- 0463US8106523B2Liquid resin composition, semi-conductor device, and process of fabricating the sameKANAGAWA NAOKI·Filed 2009·Granted Jan 31, 2012·7 cites·11 claims
- 0562US10797013B2Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 6, 2020·1 cites·12 claims
- 0646US11674032B2Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 13, 2023·0 cites·8 claims
- 0745US11195769B2Thermosetting composition for use as underfill material, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →