Inventor · disambiguated record
Naoyoshi Kawahara
Also filed as: KAWAHARA NAOYOSHI
10 granted patents·2 pending applications·25 citations·filing 1999–2014
85Inventor score
Top patents by PatentIndex Score
12 records- 0173US7239002B2Integrated circuit deviceNEC CORP·Filed 2005·Granted Jul 3, 2007·6 cites·20 claims
- 0271US7391092B2Integrated circuit including a temperature monitor element and thermal conducting layerNEC ELECTRONICS CORP·Filed 2005·Granted Jun 24, 2008·5 cites·18 claims
- 0369US8513033B2Method, design apparatus, and design program of semiconductor device, and semiconductor deviceKAWAHARA NAOYOSHI·Filed 2010·Granted Aug 20, 2013·4 cites·9 claims
- 0466US7462921B2Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide filmNEC CORP·Filed 2005·Granted Dec 9, 2008·2 cites·20 claims
- 0562US7986025B2Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Jul 26, 2011·2 cites·9 claims
- 0661US7741692B2Integrated circuit device with temperature monitor membersNEC ELECTRONICS CORP·Filed 2005·Granted Jun 22, 2010·2 cites·10 claims
- 0761US7485566B2Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 3, 2009·2 cites·19 claims
- 0845US7863744B2Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Jan 4, 2011·0 cites·13 claims
- 0944US2011256710A1Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 1041US7777288B2Integrated circuit device and fabrication method thereforNEC ELECTRONICS CORP·Filed 2005·Granted Aug 17, 2010·0 cites·21 claims
- 1140US2015108570A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1229US6521505B2Manufacturing method of semiconductor deviceNEC CORP·Filed 1999·Granted Feb 18, 2003·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →