Inventor · disambiguated record
Naoki Kawanabe
Also filed as: KAWANABE NAOKI
9 granted patents·2 pending applications·47 citations·filing 2003–2017
85Inventor score
Top patents by PatentIndex Score
11 records- 0189US7981788B2Semiconductor device and a manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2006·Granted Jul 19, 2011·20 cites·19 claims
- 0286US8946705B2Semiconductor deviceYASUMURA BUNJI·Filed 2010·Granted Feb 3, 2015·10 cites·23 claims
- 0378US9824944B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·2 cites·21 claims
- 0468US7449786B2Semiconductor device having improved adhesion between bonding and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2006·Granted Nov 11, 2008·6 cites·8 claims
- 0565US7049214B2Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·8 cites·13 claims
- 0658US8530278B2Semiconductor device and a manufacturing method of the sameMUTO NOBUYASU·Filed 2011·Granted Sep 10, 2013·1 cites·10 claims
- 0756US10163740B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·0 cites·9 claims
- 0850US2015137125A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0939US7015127B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Mar 21, 2006·0 cites·3 claims
- 1037US2003168740A1Semiconductor device and a method of manufacturing the sameFiled 2003·Application pending·0 cites
- 1135US9508678B2Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →