Inventor · disambiguated record
Namgu Kim
Also filed as: KIM NAMGU
2 granted patents·2 pending applications·0 citations·filing 2021–2024
31Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0178US12211803B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·22 claims
- 0268US11894314B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 6, 2024·0 cites·25 claims
- 0356US2025125295A1Semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0455US2025118611A1Electronic package assembly and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →