Inventor · disambiguated record
Naveen Kini
Also filed as: KINI NAVEEN
5 granted patents·1 pending application·32 citations·filing 2007–2014
75Inventor score
Top patents by PatentIndex Score
6 records- 0191US8817511B2PCB circuit modification from multiple to individual chip enable signalsMCCARTHY MICHAEL·Filed 2010·Granted Aug 26, 2014·12 cites·18 claims
- 0284US7778057B2PCB circuit modification from multiple to individual chip enable signalsSANDISK CORP·Filed 2007·Granted Aug 17, 2010·16 cites·17 claims
- 0372US7709278B2Method of making PCB circuit modification from multiple to individual chip enable signalsSANDISK CORP·Filed 2007·Granted May 4, 2010·4 cites·29 claims
- 0442US8637779B2Electronic component including micro ballsUPADHYAYULA SURESH·Filed 2011·Granted Jan 28, 2014·0 cites·20 claims
- 0535US10028380B2Semiconductor package with dual second level electrical interconnectionsSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jul 17, 2018·0 cites·11 claims
- 0632US2012281377A1Vias for mitigating pad delaminationKINI NAVEEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →