Inventor · disambiguated record
Natsuki Kobayashi
Also filed as: KOBAYASHI NATSUKI
9 granted patents·100 citations·filing 2004–2009
88Inventor score
Top patents by PatentIndex Score
9 records- 0196US7491758B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting filmNITTO DENKO CORP·Filed 2005·Granted Feb 17, 2009·32 cites·14 claims
- 0294US7691925B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting filmNITTO DENKO CORP·Filed 2005·Granted Apr 6, 2010·18 cites·18 claims
- 0393US7887914B2Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting filmsNITTO DENKO CORP·Filed 2005·Granted Feb 15, 2011·17 cites·27 claims
- 0485US7989525B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting filmNITTO DENKO CORP·Filed 2009·Granted Aug 2, 2011·4 cites·11 claims
- 0584US7846999B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting filmNITTO DENKO CORP·Filed 2005·Granted Dec 7, 2010·4 cites·10 claims
- 0684US7842742B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting filmNITTO DENKO CORP·Filed 2008·Granted Nov 30, 2010·6 cites·10 claims
- 0777US8092907B2Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets and surface protecting filmsKOBAYASHI NATSUKI·Filed 2005·Granted Jan 10, 2012·4 cites·22 claims
- 0865US7585907B2Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereonNITTO DENKO CORP·Filed 2004·Granted Sep 8, 2009·6 cites·14 claims
- 0964US8153251B2Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetsKOBAYASHI NATSUKI·Filed 2005·Granted Apr 10, 2012·9 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →