Inventor · disambiguated record
Naoyuki Kushihara
Also filed as: KUSHIHARA NAOYUKI
17 granted patents·19 pending applications·4 citations·filing 2014–2025
86Inventor score
Files withSHINETSU CHEMICAL CO36
Top patents by PatentIndex Score
36 records- 0182US12012485B2Heat-curable citraconimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Granted Jun 18, 2024·1 cites·14 claims
- 0275US10793712B2Heat-curable resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 6, 2020·2 cites·6 claims
- 0374US12110356B2Heat-curable resin compositionSHINETSU CHEMICAL CO·Filed 2022·Granted Oct 8, 2024·0 cites·15 claims
- 0474US2024327688A1Epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0572US10865304B2Heat-curable resin composition, heat-curable resin film and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 15, 2020·0 cites·10 claims
- 0663US2025388747A1Epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0762US10829589B2Heat-curable resin compositionSHINETSU CHEMICAL CO·Filed 2019·Granted Nov 10, 2020·0 cites·19 claims
- 0862US2023159743A1Heat-curable epoxy resin composition and heat-curable epoxy resin sheetSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0961US2022153919A1Silicone hybrid resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1059US9633921B2Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin compositionSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 25, 2017·1 cites·6 claims
- 1158US2024425718A1Underfill compositionSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1255US12146057B2Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2021·Granted Nov 19, 2024·0 cites·16 claims
- 1354US2019355638A1Heat-curable maleimide resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1454US2019338094A1Quartz glass fiber-containing prepreg and quartz glass fiber-containing substrateSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1554US2021054152A1Heat-curable resin composition, and adhesive agent, film, prepreg, laminate, circuit board and printed-wiring board using sameSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1652US10730273B2Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 1751US11984327B2Method for producing power module, and power moduleSHINETSU CHEMICAL CO·Filed 2021·Granted May 14, 2024·0 cites·18 claims
- 1850US10850482B2Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 1949US10407536B2Heat-curable resin composition for semiconductor encapsulationSHINETSU CHEMICAL CO·Filed 2018·Granted Sep 10, 2019·0 cites·5 claims
- 2046US9382421B2Heat-curable resin compositionSHINETSU CHEMICAL CO·Filed 2015·Granted Jul 5, 2016·0 cites·4 claims
- 2145US2017009007A1Heat-curable resin composition for semiconductor encapsulationSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 2244US9711378B2Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor deviceSHINETSU CHEMICAL CO·Filed 2014·Granted Jul 18, 2017·0 cites·10 claims
- 2344US2018112072A1Liquid epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 2444US2017058102A1Heat-curable resin compositionSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 2544US2018066101A1Heat-curable epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 2643US2017174879A1Liquid epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 2743US2017362428A1Epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 2841US11059973B2Heat-curable resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Jul 13, 2021·0 cites·7 claims
- 2941US11046848B2Heat-curable resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 29, 2021·0 cites·12 claims
- 3041US2017037238A1Heat-curable epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 3140US9972507B2Method for encapsulating large-area semiconductor element-mounted base materialSHINETSU CHEMICAL CO·Filed 2017·Granted May 15, 2018·0 cites·12 claims
- 3240US2016340470A1Liquid resin compositionSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
- 3339US2018327542A1Epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Application pending·0 cites
- 3437US10385203B2Heat-curable resin composition for semiconductor encapsulationSHINETSU CHEMICAL CO·Filed 2017·Granted Aug 20, 2019·0 cites·6 claims
- 3533US2016152821A1Resin composition for semiconductor encapsulation and semiconductor encapsulation method using sameSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
- 3633US2016186024A1Liquid underfill material composition for sealing semiconductor and flip-chip semiconductor deviceSHINETSU CHEMICAL CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →